Inventor

DREWERY JOHN

US39 patents

⚠️ This page may combine multiple inventors who share the name “DREWERY JOHN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

DREWERY JOHN

LAM RES CORP

Systems and methods for reverse pulsing

Systems and methods for reverse pulsing

RF voltage sensor incorporating multiple voltage dividers for detecting RF voltages at a pickup device of a substrate support

Large dynamic range RF voltage sensor and method for voltage mode RF bias application of plasma processing systems

Methods and systems for advanced ion control for etching processes

Methods and systems for advanced ion control for etching processes

Systems and methods for applying frequency and match tuning in a non-overlapping manner for processing substrate

Time multiplexed chemical delivery system

Air cooled faraday shield and methods for using the same

Integrated atomic layer passivation in TCP etch chamber and in-situ etch-ALP method

Gas delivery system

Systems and methods for compensating for RF power loss

Systems and methods for multi-level pulsing in RF plasma tools

Systems and methods for reverse pulsing

Electrostatic chuck with spatially tunable RF coupling to a wafer

Methods and systems for advanced ion control for etching processes

Systems for reverse pulsing

Air cooled faraday shield and methods for using the same

Methods and systems for advanced ion control for etching processes

Systems and methods for compensating for RF power loss

Voltage transient detector and current transient detector

Air cooled faraday shield and methods for using the same

Hollow RF feed with coaxial DC power feed

Track and hold feedback control of pulsed RF

Symmetric coupling of coil to direct-drive radiofrequency power supplies

NOVELLUS SYSTEMS INC

Method for enhancing the nucleation and morphology of ruthenium films on dielectric substrates using amine containing compounds

Selective electrochemical accelerator removal

Methods for the electrochemical deposition of copper onto a barrier layer of a work piece

Conductive planarization assembly for electrochemical mechanical planarization of a work piece

Conductive contacts and methods for fabricating conductive contacts for elctrochemical planarization of a work piece

Method for enhancing the nucleation and morphology of ruthenium films on dielectric substrates using amine containing compounds

TOKYO ELECTRON LTD

Immersed inductively—coupled plasma source

Electrostatic control of deposition of, and etching by, ionized materials in semiconductor processing

RF bias control in plasma deposition and etch systems with multiple RF power sources

Inductively-coupled plasma processing system

DREWERY JOHN

Internal Faraday shield having distributed chevron patterns and correlated positioning relative to external inner and outer TCP coil

Substrate clamping system and method for operating the same

ASHTIANI KAIHAN

Gap fill integration

LONG MAOLIN

Faraday shield having plasma density decoupling structure between TCP coil zones