Inventor

ZHANG RON

US33 patents

⚠️ This page may combine multiple inventors who share the name “ZHANG RON”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

ZHANG RON

NUBIS COMMUNICATIONS INC

Communication systems having co-packaged optical modules

Data processing systems including optical communication modules

Data processing systems including optical communication modules

Communication systems having optical power supplies

Communication systems having pluggable modules

Data processing systems including optical communication modules

Optical fiber-to-chip interconnection

Thermal design for rack mount systems including optical communication modules

Optical fiber-to-chip interconnection

Communication systems having co-packaged optical modules

Communication systems having pluggable modules

Communication systems having optical power supplies

Data processing systems including optical communication modules

ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC

Fluid channel geometry optimizations to improve cooling efficiency

Hotspot mitigation in fluid cooling

Cold plate and manifold integration for high reliability

Embedded cooling systems for advanced device packaging and methods of manufacturing the same

Electronic device cooling structures bonded to semiconductor elements

Cold plate cavity designs for improved thermal performance

Embedded cooling systems for advanced device packaging and methods of manufacturing the same

Manifold designs for embedded liquid cooling in a package

OSHKOSH DEFENSE LLC

Systems and methods for determining vehicle characteristics

Systems and methods for adapting tractive elements to a disabling event

Systems and methods for adapting tractive elements to a disabling event

High pressure gas spring controls for improved vehicle leveling

High pressure gas spring controls for improved vehicle leveling

Systems and methods for adapting tractive elements to a disabling event

Systems and methods for determining vehicle characteristics

SUN MICROSYSTEMS INC

SRAM heat sink assembly and method of assembling

EMI shielding apparatus

Mechanism for determining an accelerated test specification for device elements

INVENSAS CORP

Stacked die integrated circuit

Stacked die integrated circuit