Inventor

ZHANG LEILEI

US32 patents

⚠️ This page may combine multiple inventors who share the name “ZHANG LEILEI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

ZHANG LEILEI

NVIDIA CORP

Variable-size solder bump structures for integrated circuit packaging

Microelectronic package with stress-tolerant solder bump pattern

Low-profile chip package with modified heat spreader

Offset integrated circuit packaging interconnects

Open solder mask and or dielectric to increase lid or ring thickness and contact area to improve package coplanarity

Absorbing excess under-fill flow with a solder trench

Integrated circuit package with a conductive grid formed in a packaging substrate

Bottom package having routing paths connected to top package and method of manufacturing the same

Method for forming an integrated circuit package

Substrate build up layer to achieve both finer design rule and better package coplanarity

Stiffening electronic packages by disposing a stiffener ring between substrate center area and conductive pad

Process for manufacturing a printed circuit board having high density microvias formed in a thick substrate

Integrated circuit package having improved coplanarity

XILINX INC

Integrated circuit package and method of attaching a lid to a substrate of an integrated circuit

Substrate for an integrated circuit package and a method of forming a substrate

Metal lid with improved adhesion to package substrate

Solder ball assembly for a semiconductor device and method of fabricating same

Flip chip integrated circuit packages accommodating exposed chip capacitors while providing structural rigidity

Metal lid with improved adhesion to package substrate

Solder ball assembly for a semiconductor device and method of fabricating same

Contact pad and method of forming a contact pad for an integrated circuit

Integrated circuit package and apparatus and method of producing an integrated circuit package

Integrated circuit package and apparatus and method of producing an integrated circuit package

APPLE INC

Vertical module and perpendicular pin array interconnect for stacked circuit board structure

System in package for lower z height and reworkable component assembly

Flex board and flexible module

Selective soldering with photonic soldering technology

ZHANG LEILEI

Barrier layer to prevent conductive anodic filaments

System, method, and computer program product for affixing a post to a substrate pad

SCHLUMBERGER TECHNOLOGY CORP

Methods and systems for predicting interfacial tension of reservoir fluids using downhole fluid measurements

YIP LAURENE

Lead-free structures in a semiconductor device

UBALDO PEDRO R

Method of enabling a circuit board analysis