Inventor
LIU CHIN-KAI
TW10 patents
Patents
10 patentsUS5923088AJul 13, 1999
Bond pad structure for the via plug process
TAIWAN SEMICONDUCTOR MFG96 citations96
US5700735ADec 23, 1997
Method of forming bond pad structure for the via plug process
TAIWAN SEMICONDUCTOR MFG126 citations96
US6397373B1May 28, 2002
Efficient design rule check (DRC) review system
TAIWAN SEMICONDUCTOR MFG50 citations91
US5990478ANov 23, 1999
Method for preparing thin specimens consisting of domains of different materials
TAIWAN SEMICONDUCTOR MFG28 citations91
US6403386B1Jun 11, 2002
Method and apparatus for identifying failure sites on IC chips
TAIWAN SEMICONDUCTOR MFG6 citations72
US6245683B1Jun 12, 2001
Stress relieve pattern for damascene process
TAIWAN SEMICONDUCTOR MFG9 citations72
US6121059ASep 19, 2000
Method and apparatus for identifying failure sites on IC chips
TAIWAN SEMICONDUCTOR MFG10 citations72
US5963040AOct 5, 1999
Method and apparatus for detecting pin-holes in a passivation layer
TAIWAN SEMICONDUCTOR MFG12 citations72
US6394409B1May 28, 2002
Real time observable sample mounting fixture
TAIWAN SEMICONDUCTOR MFG4 citations62
US6890772B2May 10, 2005
Method and apparatus for determining two dimensional doping profiles with SIMS
TAIWAN SEMICONDUCTOR MFG4 citations54