Inventor

BOTULA ALAN BERNARD

US5 patents

⚠️ This page may combine multiple inventors who share the name “BOTULA ALAN BERNARD”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

IBM

2 patents

US6549061B2Apr 15, 2003

Electrostatic discharge power clamp circuit

IBM22 citations90

US7772083B2Aug 10, 2010

Trench forming method and structure

IBM4 citations57

BOTULA ALAN BERNARD

2 patents

US8089126B2Jan 3, 2012

Method and structures for improving substrate loss and linearity in SOI substrates

BOTULA ALAN BERNARD9 citations79

US8288821B2Oct 16, 2012

SOI (silicon on insulator) substrate improvements

BOTULA ALAN BERNARD0 citations37

GLOBALFOUNDRIES INC

1 patent

US9978849B2May 22, 2018

SOI-MOSFET gate insulation layer with different thickness

GLOBALFOUNDRIES INC0 citations39