Inventor

SENGUPTA PRIANKA

US2 patents

Patents

2 patents

US10790204B2Sep 29, 2020

Test structure leveraging the lowest metallization level of an interconnect structure

GLOBALFOUNDRIES INC0 citations47

US10796973B2Oct 6, 2020

Test structures connected with the lowest metallization levels in an interconnect structure

GLOBALFOUNDRIES INC0 citations36