Inventor
WEI TE YU
TW7 patents
Patents
7 patentsUS10899945B2Jan 26, 2021
Use of a chemical mechanical polishing (CMP) composition for polishing of cobalt comprising substrates
BASF SE3 citations71
US12378439B2Aug 5, 2025
Compositions for tungsten etching inhibition
BASF SE0 citations49
US12351737B2Jul 8, 2025
Chemical mechanical polishing of substrates containing copper and ruthenium
BASF SE0 citations49
US11993729B2May 28, 2024
Chemical mechanical polishing composition
BASF SE0 citations49
US11725117B2Aug 15, 2023
Chemical mechanical polishing of substrates containing copper and ruthenium
BASF SE0 citations49
US10844325B2Nov 24, 2020
Composition for post chemical-mechanical-polishing cleaning
BASF SE0 citations48
US10844333B2Nov 24, 2020
Composition for post chemical-mechanical-polishing cleaning
BASF SE0 citations36