Inventor

LEE CHUNGSUN

KR35 patents

⚠️ This page may combine multiple inventors who share the name “LEE CHUNGSUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LEE CHUNGSUN

SAMSUNG ELECTRONICS CO LTD

Methods for processing substrates

Semiconductor packages having first and second redistribution patterns

Semiconductor package

Wafer trimming device

Semiconductor device including lower pads having different widths and semiconductor package including the same

Semiconductor packages

Semiconductor package and method of fabricating the same

Interconnection structure and semiconductor package including the same

Interconnection structure, method of fabricating the same, and semiconductor package including interconnection structure

Semiconductor package including fine redistribution patterns

Semiconductor package including an image sensor chip and a method of fabricating the same

Interconnection structure, method of fabricating the same, and semiconductor package including interconnection structure

Interconnection structure and semiconductor package including the same

Semiconductor package including an image sensor chip and a method of fabricating the same

Methods for processing substrates

Semiconductor device and semiconductor package including the same

Wafer structure and semiconductor device

Semiconductor device, semiconductor package and method of manufacturing the same

Method of manufacturing semiconductor package

Semiconductor device and semiconductor package including the same

Semiconductor chip, semiconductor package including the same, and method of fabricating the same

Semiconductor package and method of manufacturing the same

Molding apparatus of semiconductor package

Interconnection structure and semiconductor package including the same

Semiconductor package and method of manufacturing the semiconductor package

Dry etching apparatus and wafer etching system using the same

Semiconductor package and method of manufacturing the same

Methods of processing substrates

CHOI EUN-KYOUNG

Semiconductor packages and methods of fabricating the same

Semiconductor packages and methods of fabricating the same

CHOI YUNSEOK

Semiconductor package having through silicon via (TSV) interposer and method of manufacturing the semiconductor package

KANG UN BYOUNG

Method of fabricating a semiconductor device

KWON YONGHWAN

Bump structure for a semiconductor device and method of manufacture

AHN JUNG-SEOK

Methods of processing substrates

JEONG SEYOUNG

Semiconductor device for semiconductor package having through silicon vias of different heights