Inventor
SCHWEINFURTH RALPH A
US2 patents
Patents
2 patentsUS5843846ADec 1, 1998
Etch process to produce rounded top corners for sub-micron silicon trench applications
INTEL CORP76 citations92
US5933759AAug 3, 1999
Method of controlling etch bias with a fixed lithography pattern for sub-micron critical dimension shallow trench applications
INTEL CORP37 citations90