Inventor
KIM YOUNG LYONG
KR42 patents
⚠️ This page may combine multiple inventors who share the name “KIM YOUNG LYONG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
36 patentsUS10658300B2May 19, 2020
Semiconductor package and semiconductor device including the same
SAMSUNG ELECTRONICS CO LTD20 citations86
US10438899B2Oct 8, 2019
Semiconductor packages
SAMSUNG ELECTRONICS CO LTD5 citations84
US10431547B2Oct 1, 2019
Semiconductor package
SAMSUNG ELECTRONICS CO LTD9 citations83
US8053881B2Nov 8, 2011
Semiconductor package and method for manufacturing the same
SAMSUNG ELECTRONICS CO LTD10 citations82
US11257793B2Feb 22, 2022
Semiconductor devices and methods for manufacturing the same
SAMSUNG ELECTRONICS CO LTD2 citations73
US9281235B2Mar 8, 2016
Semiconductor packages and methods of forming the same
SAMSUNG ELECTRONICS CO LTD3 citations73
US11462479B2Oct 4, 2022
Semiconductor package
SAMSUNG ELECTRONICS CO LTD4 citations72
US10847447B2Nov 24, 2020
Semiconductor device having planarized passivation layer and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD2 citations72
US9024448B2May 5, 2015
Lower semiconductor molding die, semiconductor package, and method of manufacturing the semiconductor package
SAMSUNG ELECTRONICS CO LTD4 citations72
US8884446B2Nov 11, 2014
Semiconductor packages
SAMSUNG ELECTRONICS CO LTD4 citations72
US10770446B2Sep 8, 2020
Semiconductor packages and methods of manufacturing the same
SAMSUNG ELECTRONICS CO LTD4 citations70
US7745907B2Jun 29, 2010
Semiconductor package including connector disposed in troughhole
SAMSUNG ELECTRONICS CO LTD2 citations63
US12476225B2Nov 18, 2025
Semiconductor package and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD0 citations62
US12100681B2Sep 24, 2024
Semiconductor package and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD0 citations62
US12002786B2Jun 4, 2024
Semiconductor package and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD0 citations62
US11830853B2Nov 28, 2023
Semiconductor devices and methods for manufacturing the same
SAMSUNG ELECTRONICS CO LTD0 citations62
US11817411B2Nov 14, 2023
Semiconductor package and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD0 citations62
US11705430B2Jul 18, 2023
Semiconductor package including mold layer having curved cross-section shape
SAMSUNG ELECTRONICS CO LTD0 citations62
US11488894B2Nov 1, 2022
Semiconductor device having planarized passivation layer and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD0 citations62
US11031347B2Jun 8, 2021
Semiconductor packages
SAMSUNG ELECTRONICS CO LTD1 citations62
US10964670B2Mar 30, 2021
Semiconductor package and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD0 citations62
US10804218B2Oct 13, 2020
Semiconductor package
SAMSUNG ELECTRONICS CO LTD1 citations62
US9159705B2Oct 13, 2015
Semiconductor chip connecting semiconductor package
SAMSUNG ELECTRONICS CO LTD2 citations62
US12388024B2Aug 12, 2025
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations61
US12218100B2Feb 4, 2025
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations61
US12033948B2Jul 9, 2024
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations61
US8354744B2Jan 15, 2013
Stacked semiconductor package having reduced height
SAMSUNG ELECTRONICS CO LTD4 citations61
US7759795B2Jul 20, 2010
Printed circuit board having reliable bump interconnection structure, method of fabricating the same, and semiconductor package using the same
SAMSUNG ELECTRONICS CO LTD2 citations58
US12394738B2Aug 19, 2025
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations52
US12598758B2Apr 7, 2026
Semiconductor device including dummy pad
SAMSUNG ELECTRONICS CO LTD0 citations51
US12446237B2Oct 14, 2025
Semiconductor device
SAMSUNG ELECTRONICS CO LTD0 citations51
US12159858B2Dec 3, 2024
Semiconductor package and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD0 citations51
US9570423B2Feb 14, 2017
Semiconductor package and method of manufacturing the semiconductor package
SAMSUNG ELECTRONICS CO LTD1 citations51
US12500194B2Dec 16, 2025
Semiconductor package and method for fabricating the same
SAMSUNG ELECTRONICS CO LTD0 citations50
US10177131B2Jan 8, 2019
Semiconductor packages and methods of manufacturing the same
SAMSUNG ELECTRONICS CO LTD0 citations49
US12100635B2Sep 24, 2024
Semiconductor package and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD0 citations47