Inventor
WU HAOSHENG
US30 patents
⚠️ This page may combine multiple inventors who share the name “WU HAOSHENG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
APPLIED MATERIALS INC
29 patentsUS11446711B2Sep 20, 2022
Steam treatment stations for chemical mechanical polishing system
APPLIED MATERIALS INC8 citations85
US11633833B2Apr 25, 2023
Use of steam for pre-heating of CMP components
APPLIED MATERIALS INC3 citations72
US11597052B2Mar 7, 2023
Temperature control of chemical mechanical polishing
APPLIED MATERIALS INC2 citations71
US11077536B2Aug 3, 2021
Slurry distribution device for chemical mechanical polishing
APPLIED MATERIALS INC2 citations71
US10967483B2Apr 6, 2021
Slurry distribution device for chemical mechanical polishing
APPLIED MATERIALS INC2 citations71
US12296427B2May 13, 2025
Apparatus and method for CMP temperature control
APPLIED MATERIALS INC1 citations64
US12576475B2Mar 17, 2026
Determining the orientation of a substrate in-situ
APPLIED MATERIALS INC0 citations62
US12459011B2Nov 4, 2025
Steam treatment stations for chemical mechanical polishing system
APPLIED MATERIALS INC0 citations62
US12434347B2Oct 7, 2025
Method for CMP temperature control
APPLIED MATERIALS INC0 citations62
US12318882B2Jun 3, 2025
Apparatus and method for CMP temperature control
APPLIED MATERIALS INC0 citations62
US12290896B2May 6, 2025
Apparatus and method for CMP temperature control
APPLIED MATERIALS INC0 citations62
US12030093B2Jul 9, 2024
Steam treatment stations for chemical mechanical polishing system
APPLIED MATERIALS INC0 citations62
US11897079B2Feb 13, 2024
Low-temperature metal CMP for minimizing dishing and corrosion, and improving pad asperity
APPLIED MATERIALS INC1 citations62
US11865671B2Jan 9, 2024
Temperature-based in-situ edge assymetry correction during CMP
APPLIED MATERIALS INC0 citations62
US11752589B2Sep 12, 2023
Chemical mechanical polishing temperature scanning apparatus for temperature control
APPLIED MATERIALS INC0 citations62
US11628478B2Apr 18, 2023
Steam cleaning of CMP components
APPLIED MATERIALS INC0 citations62
US12472604B2Nov 18, 2025
Grounding techniques for ESD polymeric fluid lines
APPLIED MATERIALS INC0 citations61
US12459078B2Nov 4, 2025
In-situ conditioner disk cleaning during CMP
APPLIED MATERIALS INC0 citations61
US12290897B2May 6, 2025
Fluid-tight electrical connection techniques for semiconductor processing
APPLIED MATERIALS INC0 citations61
US11986926B2May 21, 2024
Slurry distribution device for chemical mechanical polishing
APPLIED MATERIALS INC0 citations61
US11806835B2Nov 7, 2023
Slurry distribution device for chemical mechanical polishing
APPLIED MATERIALS INC0 citations61
US12403561B2Sep 2, 2025
Eddy current monitoring to detect vibration in polishing
APPLIED MATERIALS INC1 citations59
US12106976B2Oct 1, 2024
Steam-assisted single substrate cleaning process and apparatus
APPLIED MATERIALS INC0 citations59
US11728185B2Aug 15, 2023
Steam-assisted single substrate cleaning process and apparatus
APPLIED MATERIALS INC1 citations59
US11697187B2Jul 11, 2023
Temperature-based assymetry correction during CMP and nozzle for media dispensing
APPLIED MATERIALS INC0 citations59
US11826872B2Nov 28, 2023
Temperature and slurry flow rate control in CMP
APPLIED MATERIALS INC0 citations52
US12392427B2Aug 19, 2025
Insulated fluid lines in chemical mechanical polishing
APPLIED MATERIALS INC0 citations50
US12214468B2Feb 4, 2025
Temperature control of chemical mechanical polishing
APPLIED MATERIALS INC0 citations50
US11833637B2Dec 5, 2023
Control of steam generation for chemical mechanical polishing
APPLIED MATERIALS INC0 citations48