Inventor
OHKI KENJI
JP10 patents
⚠️ This page may combine multiple inventors who share the name “OHKI KENJI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SUMITOMO ELECTRIC INDUSTRIES
6 patentsUS7307290B2Dec 11, 2007
Compound semiconductor wafer and manufacturing method thereof
SUMITOMO ELECTRIC INDUSTRIES8 citations72
US6835990B2Dec 28, 2004
Semiconductor light receiving element
SUMITOMO ELECTRIC INDUSTRIES4 citations62
US11013113B2May 18, 2021
Base material for printed circuit board and printed circuit board
SUMITOMO ELECTRIC INDUSTRIES0 citations60
US10610928B2Apr 7, 2020
Powder for conductive material, ink for conductive material, conductive paste, and method for producing powder for conductive material
SUMITOMO ELECTRIC INDUSTRIES1 citations60
US11752734B2Sep 12, 2023
Base material for printed circuit board and printed circuit board
SUMITOMO ELECTRIC INDUSTRIES0 citations59
US10796812B2Oct 6, 2020
Coating liquid for forming conductive layer, method for producing conductive layer, and conductive layer
SUMITOMO ELECTRIC INDUSTRIES0 citations50