Inventor

CHEN YEH-SHUN

TW2 patents

Patents

2 patents

US8050467B2Nov 1, 2011

Package, packaging method and substrate thereof for sliding type thin fingerprint sensor

CHIPBOND TECHNOLOGY CORP11 citations76

US7953257B2May 31, 2011

Sliding type thin fingerprint sensor package

CHIPBOND TECHNOLOGY CORP3 citations51