Inventor
SAIKI NAOYA
JP14 patents
⚠️ This page may combine multiple inventors who share the name “SAIKI NAOYA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
LINTEC CORP
11 patentsUS7935574B2May 3, 2011
Marking method and sheet for both protective film forming and dicing
LINTEC CORP32 citations89
US10030174B2Jul 24, 2018
Composite sheet for forming protective film
LINTEC CORP3 citations72
US7842551B2Nov 30, 2010
Adhesive composition, adhesive sheet and production process for semiconductor device
LINTEC CORP4 citations60
US7674859B2Mar 9, 2010
Adhesive composition and adhesive sheet
LINTEC CORP6 citations60
US10399306B2Sep 3, 2019
Protective film forming film, sheet for forming protective film, and inspection method
LINTEC CORP0 citations51
US9562179B2Feb 7, 2017
Adhesive composition, adhesive sheet and production process for semiconductor device
LINTEC CORP0 citations50
US10510578B2Dec 17, 2019
Protective film forming film, protective film forming sheet and work product manufacturing method
LINTEC CORP0 citations49
US7851335B2Dec 14, 2010
Adhesive composition, adhesive sheet and production method of semiconductor device
LINTEC CORP1 citations49
US12146081B2Nov 19, 2024
Peel-off detection label
LINTEC CORP0 citations45
US9953946B2Apr 24, 2018
Die-bonding layer formation film, processed product having die-bonding layer formation film attached thereto, and semiconductor device
LINTEC CORP0 citations45
US10190017B2Jan 29, 2019
Protective film-forming film and method of manufacturing semiconductor chip with protective film
LINTEC CORP0 citations40