Inventor
POUTASSE CHARLES A
US11 patents
⚠️ This page may combine multiple inventors who share the name “POUTASSE CHARLES A”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
GOULD ELECTRONICS INC
6 patentsUS6268070B1Jul 31, 2001
Laminate for multi-layer printed circuit
GOULD ELECTRONICS INC20 citations90
US5629098AMay 13, 1997
Epoxy adhesives and copper foils and copper clad laminates using same
GOULD ELECTRONICS INC27 citations88
US6221176B1Apr 24, 2001
Surface treatment of copper to prevent microcracking in flexible circuits
GOULD ELECTRONICS INC17 citations82
US5525433AJun 11, 1996
Epoxy adhesives and copper foils and copper clad laminates using same
GOULD ELECTRONICS INC17 citations77
US6589381B2Jul 8, 2003
Coatings for improved resin dust resistance
GOULD ELECTRONICS INC4 citations73
US5614324AMar 25, 1997
Multi-layer structures containing a silane adhesion promoting layer
GOULD ELECTRONICS INC15 citations66
GA TEK INC
3 patentsUS6296949B1Oct 2, 2001
Copper coated polyimide with metallic protective layer
GA TEK INC58 citations93
US6132851AOct 17, 2000
Adhesive compositions and copper foils and copper clad laminates using same
GA TEK INC27 citations91
US6117536ASep 12, 2000
Adhesion promoting layer for use with epoxy prepregs
GA TEK INC20 citations91