P

Inventor

KONONCHUK OLEG V

US17 patents
⚠️ This page may combine multiple inventors who share the name “KONONCHUK OLEG V”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SEH AMERICA INC

16 patents
US6284986B1Sep 4, 2001

Method of determining the thickness of a layer on a silicon substrate

SEH AMERICA INC74 citations95
US6190453B1Feb 20, 2001

Growth of epitaxial semiconductor material with improved crystallographic properties

SEH AMERICA INC70 citations95
US6184154B1Feb 6, 2001

Method of processing the backside of a wafer within an epitaxial reactor chamber

SEH AMERICA INC30 citations92
US6703290B2Mar 9, 2004

Growth of epitaxial semiconductor material with improved crystallographic properties

SEH AMERICA INC29 citations91
US6286685B1Sep 11, 2001

System and method for wafer thickness sorting

SEH AMERICA INC35 citations90
US6059875AMay 9, 2000

Method of effecting nitrogen doping in Czochralski grown silicon crystal

SEH AMERICA INC32 citations89
US6352071B1Mar 5, 2002

Apparatus and method for reducing bow and warp in silicon wafers sliced by a wire saw

SEH AMERICA INC23 citations86
US7112509B2Sep 26, 2006

Method of producing a high resistivity SIMOX silicon substrate

SEH AMERICA INC16 citations83
US6673147B2Jan 6, 2004

High resistivity silicon wafer having electrically inactive dopant and method of producing same

SEH AMERICA INC16 citations82
US6562128B1May 13, 2003

In-situ post epitaxial treatment process

SEH AMERICA INC10 citations73
US6669777B2Dec 30, 2003

Method of producing a high resistivity silicon wafer utilizing heat treatment that occurs during device fabrication

SEH AMERICA INC9 citations72
US6583024B1Jun 24, 2003

High resistivity silicon wafer with thick epitaxial layer and method of producing same

SEH AMERICA INC7 citations72
US6565652B1May 20, 2003

High resistivity silicon wafer and method of producing same using the magnetic field Czochralski method

SEH AMERICA INC8 citations72
US6506667B2Jan 14, 2003

Growth of epitaxial semiconductor material with improved crystallographic properties

SEH AMERICA INC2 citations61
US6416391B1Jul 9, 2002

Method of demounting silicon wafers after polishing

SEH AMERICA INC0 citations51
US6669775B2Dec 30, 2003

High resistivity silicon wafer produced by a controlled pull rate czochralski method

SEH AMERICA INC1 citations50

SEH AMERICA

1 patent