Inventor
KONONCHUK OLEG V
US17 patents
⚠️ This page may combine multiple inventors who share the name “KONONCHUK OLEG V”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SEH AMERICA INC
16 patentsUS6284986B1Sep 4, 2001
Method of determining the thickness of a layer on a silicon substrate
SEH AMERICA INC74 citations95
US6190453B1Feb 20, 2001
Growth of epitaxial semiconductor material with improved crystallographic properties
SEH AMERICA INC70 citations95
US6184154B1Feb 6, 2001
Method of processing the backside of a wafer within an epitaxial reactor chamber
SEH AMERICA INC30 citations92
US6703290B2Mar 9, 2004
Growth of epitaxial semiconductor material with improved crystallographic properties
SEH AMERICA INC29 citations91
US6286685B1Sep 11, 2001
System and method for wafer thickness sorting
SEH AMERICA INC35 citations90
US6059875AMay 9, 2000
Method of effecting nitrogen doping in Czochralski grown silicon crystal
SEH AMERICA INC32 citations89
US6352071B1Mar 5, 2002
Apparatus and method for reducing bow and warp in silicon wafers sliced by a wire saw
SEH AMERICA INC23 citations86
US7112509B2Sep 26, 2006
Method of producing a high resistivity SIMOX silicon substrate
SEH AMERICA INC16 citations83
US6673147B2Jan 6, 2004
High resistivity silicon wafer having electrically inactive dopant and method of producing same
SEH AMERICA INC16 citations82
US6562128B1May 13, 2003
In-situ post epitaxial treatment process
SEH AMERICA INC10 citations73
US6669777B2Dec 30, 2003
Method of producing a high resistivity silicon wafer utilizing heat treatment that occurs during device fabrication
SEH AMERICA INC9 citations72
US6583024B1Jun 24, 2003
High resistivity silicon wafer with thick epitaxial layer and method of producing same
SEH AMERICA INC7 citations72
US6565652B1May 20, 2003
High resistivity silicon wafer and method of producing same using the magnetic field Czochralski method
SEH AMERICA INC8 citations72
US6506667B2Jan 14, 2003
Growth of epitaxial semiconductor material with improved crystallographic properties
SEH AMERICA INC2 citations61
US6416391B1Jul 9, 2002
Method of demounting silicon wafers after polishing
SEH AMERICA INC0 citations51
US6669775B2Dec 30, 2003
High resistivity silicon wafer produced by a controlled pull rate czochralski method
SEH AMERICA INC1 citations50