Inventor
SCHOENLEBER WALTER
DE8 patents
Patents
8 patentsUS7018271B2Mar 28, 2006
Method for monitoring a substrate during chemical mechanical polishing
APPLIED MATERIALS INC127 citations98
US6247998B1Jun 19, 2001
Method and apparatus for determining substrate layer thickness during chemical mechanical polishing
APPLIED MATERIALS INC124 citations98
US6159073ADec 12, 2000
Method and apparatus for measuring substrate layer thickness during chemical mechanical polishing
APPLIED MATERIALS INC233 citations98
US6524165B1Feb 25, 2003
Method and apparatus for measuring substrate layer thickness during chemical mechanical polishing
APPLIED MATERIALS INC39 citations96
US7086929B2Aug 8, 2006
Endpoint detection with multiple light beams
APPLIED MATERIALS INC21 citations92
US6221784B1Apr 24, 2001
Method and apparatus for sequentially etching a wafer using anisotropic and isotropic etching
APPLIED MATERIALS INC27 citations88
US6764380B2Jul 20, 2004
Method and apparatus for measuring substrate layer thickness during chemical mechanical polishing
APPLIED MATERIALS INC11 citations82
US6986699B2Jan 17, 2006
Method and apparatus for determining polishing endpoint with multiple light sources
APPLIED MATERIALS INC7 citations73