Inventor
NGUYEN MY N
US29 patents
⚠️ This page may combine multiple inventors who share the name “NGUYEN MY N”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
JOHNSON MATTHEY INC
20 patentsUS6451422B1Sep 17, 2002
Thermal interface materials
JOHNSON MATTHEY INC109 citations98
US5989459ANov 23, 1999
Compliant and crosslinkable thermal interface materials
JOHNSON MATTHEY INC84 citations94
US5183784AFeb 2, 1993
Silver-glass pastes
JOHNSON MATTHEY INC65 citations93
US5859105AJan 12, 1999
Organosilicon-containing compositions capable of rapid curing at low temperature
JOHNSON MATTHEY INC22 citations92
US5852092ADec 22, 1998
Organosilicon-containing compositions having enhanced adhesive properties
JOHNSON MATTHEY INC22 citations92
US5371178ADec 6, 1994
Rapidly curing adhesive and method
JOHNSON MATTHEY INC20 citations92
US5155066AOct 13, 1992
Rapid-curing adhesive formulation for semiconductor devices
JOHNSON MATTHEY INC32 citations92
US5150195ASep 22, 1992
Rapid-curing adhesive formulation for semiconductor devices
JOHNSON MATTHEY INC47 citations92
US5612403AMar 18, 1997
Low temperature flexible die attach adhesive and articles using same
JOHNSON MATTHEY INC29 citations91
US5399907AMar 21, 1995
Low temperature flexible die attach adhesive and articles using same
JOHNSON MATTHEY INC25 citations91
US5250600AOct 5, 1993
Low temperature flexible die attach adhesive and articles using same
JOHNSON MATTHEY INC29 citations91
US5075262ADec 24, 1991
Silver-glass pastes
JOHNSON MATTHEY INC40 citations87
US5489637AFeb 6, 1996
Low temperature flexible die attach adhesive and articles using same
JOHNSON MATTHEY INC14 citations81
US5386000AJan 31, 1995
Low temperature flexible die attach adhesive and articles using same
JOHNSON MATTHEY INC15 citations74
US5195299AMar 23, 1993
Method of reducing moisture content of hermetic packages containing semiconductor devices
JOHNSON MATTHEY INC13 citations74
US5708129AJan 13, 1998
Die attach adhesive with reduced resin bleed
JOHNSON MATTHEY INC9 citations70
US5524422AJun 11, 1996
Materials with low moisture outgassing properties and method of reducing moisture content of hermetic packages containing semiconductor devices
JOHNSON MATTHEY INC3 citations63
US5164119ANov 17, 1992
Silver-glass pastes
JOHNSON MATTHEY INC2 citations57
US4986849AJan 22, 1991
Silver-glass pastes
JOHNSON MATTHEY INC4 citations57
US6117930ASep 12, 2000
Resin systems for organosilicon-containing compositions
JOHNSON MATTHEY INC2 citations54
HONEYWELL INT INC
5 patentsUS7244491B2Jul 17, 2007
Thermal interface materials
HONEYWELL INT INC29 citations92
US7172711B2Feb 6, 2007
Interface materials and methods of production and use thereof
HONEYWELL INT INC26 citations92
US6908669B2Jun 21, 2005
Thermal interface materials
HONEYWELL INT INC26 citations92
US6811725B2Nov 2, 2004
Compliant and crosslinkable thermal interface materials
HONEYWELL INT INC31 citations91
US7608324B2Oct 27, 2009
Interface materials and methods of production and use thereof
HONEYWELL INT INC8 citations76
Henkel IP & Holding GmbH
3 patentsUS11155065B2Oct 26, 2021
Compositions having a matrix and encapsulated phase change materials dispersed therein, and electronic devices assembled therewith
Henkel IP & Holding GmbH0 citations60
US10481653B2Nov 19, 2019
Compositions having a matrix and encapsulated phase change materials dispersed therein, and electronic devices assembled therewith
Henkel IP & Holding GmbH1 citations60
US9223363B2Dec 29, 2015
Electronic devices assembled with heat absorbing and/or thermally insulating composition
Henkel IP & Holding GmbH1 citations50