Inventor
NAKAZAWA MASAO
JP26 patents
⚠️ This page may combine multiple inventors who share the name “NAKAZAWA MASAO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SHINKO ELECTRIC IND CO
15 patentsUS5909053AJun 1, 1999
Lead frame and method for manufacturing same
SHINKO ELECTRIC IND CO111 citations99
US5643433AJul 1, 1997
Lead frame and method for manufacturing same
SHINKO ELECTRIC IND CO162 citations99
US5384204AJan 24, 1995
Tape automated bonding in semiconductor technique
SHINKO ELECTRIC IND CO47 citations89
US6755957B2Jun 29, 2004
Method of plating for filling via holes
SHINKO ELECTRIC IND CO15 citations84
US6398856B1Jun 4, 2002
Substitutional electroless gold plating solution, electroless gold plating method and semiconductor device
SHINKO ELECTRIC IND CO9 citations74
US5258062ANov 2, 1993
Electroless gold plating solutions
SHINKO ELECTRIC IND CO16 citations71
US4717459AJan 5, 1988
Electrolytic gold plating solution
SHINKO ELECTRIC IND CO7 citations68
US5656855AAug 12, 1997
Lead frame and method for manufacturing same
SHINKO ELECTRIC IND CO3 citations63
US7901997B2Mar 8, 2011
Method of manufacturing semiconductor device
SHINKO ELECTRIC IND CO2 citations62
US7695638B2Apr 13, 2010
Regeneration process of alkaline permanganate etching solution and unit therefor
SHINKO ELECTRIC IND CO3 citations61
US7264848B2Sep 4, 2007
Non-cyanide electroless gold plating solution and process for electroless gold plating
SHINKO ELECTRIC IND CO2 citations60
US7445965B2Nov 4, 2008
Method of manufacturing radiating plate and semiconductor apparatus using the same
SHINKO ELECTRIC IND CO4 citations59
US7402232B2Jul 22, 2008
Silver electroplating solution
SHINKO ELECTRIC IND CO1 citations49
US7807560B2Oct 5, 2010
Solder bump forming method
SHINKO ELECTRIC IND CO0 citations47
US8362369B2Jan 29, 2013
Wiring board
SHINKO ELECTRIC IND CO0 citations42