P

Inventor

WAKABAYASHI SHINICHI

JP72 patents
⚠️ This page may combine multiple inventors who share the name “WAKABAYASHI SHINICHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SHINKO ELECTRIC IND CO

20 patents
US5909053AJun 1, 1999

Lead frame and method for manufacturing same

SHINKO ELECTRIC IND CO111 citations99
US5643433AJul 1, 1997

Lead frame and method for manufacturing same

SHINKO ELECTRIC IND CO162 citations99
US7388293B2Jun 17, 2008

Interposer method of fabricating same, and semiconductor device using the same having two portions with different constructions

SHINKO ELECTRIC IND CO64 citations98
US7220657B2May 22, 2007

Semiconductor wafer and semiconductor device provided with columnar electrodes and methods of producing the wafer and device

SHINKO ELECTRIC IND CO90 citations98
US7415762B2Aug 26, 2008

Interposer, method of fabricating the same, and semiconductor device using the same

SHINKO ELECTRIC IND CO38 citations93
US6828669B2Dec 7, 2004

Interconnection substrate having metal columns covered by a resin film, and manufacturing method thereof

SHINKO ELECTRIC IND CO33 citations92
US5858560AJan 12, 1999

Organic material for el device and el device

SHINKO ELECTRIC IND CO23 citations92
US4259436AMar 31, 1981

Method of making a take-carrier for manufacturing IC elements

SHINKO ELECTRIC IND CO59 citations91
US5384204AJan 24, 1995

Tape automated bonding in semiconductor technique

SHINKO ELECTRIC IND CO47 citations89
US5311056AMay 10, 1994

Semiconductor device having a bi-level leadframe

SHINKO ELECTRIC IND CO27 citations89
US5153384AOct 6, 1992

Circuit board and process for manufacturing same

SHINKO ELECTRIC IND CO18 citations74
US7707713B2May 4, 2010

Component-embedded circuit board fabrication method

SHINKO ELECTRIC IND CO6 citations73
US5258062ANov 2, 1993

Electroless gold plating solutions

SHINKO ELECTRIC IND CO16 citations71
US5080980AJan 14, 1992

Ceramic package for semiconductor device

SHINKO ELECTRIC IND CO6 citations70
US4717459AJan 5, 1988

Electrolytic gold plating solution

SHINKO ELECTRIC IND CO7 citations68
US4604167AAug 5, 1986

Silver plating solution and silver plating process and pretreatment solution therefor

SHINKO ELECTRIC IND CO14 citations67
US5656855AAug 12, 1997

Lead frame and method for manufacturing same

SHINKO ELECTRIC IND CO3 citations63
US5620806AApr 15, 1997

Organic material for EL device and EL device

SHINKO ELECTRIC IND CO3 citations63
US7890203B2Feb 15, 2011

Wiring forming system and wiring forming method for forming wiring on wiring board

SHINKO ELECTRIC IND CO2 citations62
US7793412B2Sep 14, 2010

Component-embedded board fabrication method

SHINKO ELECTRIC IND CO3 citations62

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD

10 patents

SEIKO EPSON CORP

7 patents

WAKABAYASHI SHINICHI

5 patents

PANASONIC CORP

4 patents

SANKYO SEIKI SEISAKUSHO KK

1 patent

HONDA LOCK KK

1 patent

HONDA MOTOR CO LTD

1 patent

TOSHIBA KK

1 patent

Showing the top 50 of 72 patents by PatentIndex Score.