Inventor
BEYER KLAUS
US4 patents
⚠️ This page may combine multiple inventors who share the name “BEYER KLAUS”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
3 patentsUS5276338AJan 4, 1994
Bonded wafer structure having a buried insulation layer
IBM68 citations95
US5192708AMar 9, 1993
Sub-layer contact technique using in situ doped amorphous silicon and solid phase recrystallization
IBM44 citations92
US6599813B2Jul 29, 2003
Method of forming shallow trench isolation for thin silicon-on-insulator substrates
IBM25 citations88