Inventor
TSAO CHING-HUA
TW4 patents
⚠️ This page may combine multiple inventors who share the name “TSAO CHING-HUA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
ADVANCED SEMICONDUCTOR ENG
3 patentsUS7417313B2Aug 26, 2008
Method for manufacturing an adhesive substrate with a die-cavity sidewall
ADVANCED SEMICONDUCTOR ENG5 citations70
US7344915B2Mar 18, 2008
Method for manufacturing a semiconductor package with a laminated chip cavity
ADVANCED SEMICONDUCTOR ENG7 citations70
US7172926B2Feb 6, 2007
Method for manufacturing an adhesive substrate with a die-cavity sidewall
ADVANCED SEMICONDUCTOR ENG0 citations49