P

Inventor

SHIAU GWO-YUH

TW26 patents
⚠️ This page may combine multiple inventors who share the name “SHIAU GWO-YUH”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TAIWAN SEMICONDUCTOR MFG

17 patents
US6645851B1Nov 11, 2003

Method of forming planarized coatings on contact hole patterns of various duty ratios

TAIWAN SEMICONDUCTOR MFG98 citations96
US7709872B2May 4, 2010

Methods for fabricating image sensor devices

TAIWAN SEMICONDUCTOR MFG16 citations93
US7648851B2Jan 19, 2010

Method of fabricating backside illuminated image sensor

TAIWAN SEMICONDUCTOR MFG46 citations93
US7883917B2Feb 8, 2011

Semiconductor device with bonding pad

TAIWAN SEMICONDUCTOR MFG20 citations92
US7659595B2Feb 9, 2010

Embedded bonding pad for backside illuminated image sensor

TAIWAN SEMICONDUCTOR MFG25 citations92
US6803291B1Oct 12, 2004

Method to preserve alignment mark optical integrity

TAIWAN SEMICONDUCTOR MFG32 citations89
US6632590B1Oct 14, 2003

Enhance the process window of memory cell line/space dense pattern in sub-wavelength process

TAIWAN SEMICONDUCTOR MFG8 citations70
US7883926B2Feb 8, 2011

Methods for fabricating image sensor devices

TAIWAN SEMICONDUCTOR MFG4 citations63
US7863067B2Jan 4, 2011

Silicon substrate with reduced surface roughness

TAIWAN SEMICONDUCTOR MFG2 citations63
US7144773B1Dec 5, 2006

Method for preventing trenching in fabricating split gate flash devices

TAIWAN SEMICONDUCTOR MFG3 citations63
US8357561B2Jan 22, 2013

Method of fabricating backside illuminated image sensor

TAIWAN SEMICONDUCTOR MFG1 citations61
US7923344B2Apr 12, 2011

Method of fabricating backside illuminated image sensor

TAIWAN SEMICONDUCTOR MFG4 citations61
USRE41697ESep 14, 2010

Method of forming planarized coatings on contact hole patterns of various duty ratios

TAIWAN SEMICONDUCTOR MFG4 citations61
US8048807B2Nov 1, 2011

Method and apparatus for thinning a substrate

TAIWAN SEMICONDUCTOR MFG2 citations59
US7732299B2Jun 8, 2010

Process for wafer bonding

TAIWAN SEMICONDUCTOR MFG6 citations58
US9356108B2May 31, 2016

Dummy structure for multiple gate dielectric interface and methods

TAIWAN SEMICONDUCTOR MFG0 citations49
US8053853B2Nov 8, 2011

Color filter-embedded MSM image sensor

TAIWAN SEMICONDUCTOR MFG0 citations49

VANGUARD INT SEMICONDUCT CORP

4 patents

TIAWAN SEMICONDUCTOR MFG CO LT

1 patent

LIU HUEI-RU

1 patent

SHIAU GWO-YUH

1 patent

IND TECH RES INST

1 patent

HSIEH YUAN-CHIH

1 patent