Inventor
CHEN KER-MING
TW8 patents
Patents
8 patentsUS5112926AMay 12, 1992
Thermal-resistant resin composition for printed circuit boards based on triazine modified epoxy resin blends
IND TECH RES INST9 citations72
US5041519AAug 20, 1991
Composition comprising epoxy resin, bismaleimide and barbituric acid
IND TECH RES INST12 citations72
US5326794AJul 5, 1994
Barbituric acid-modified bismaleimide with diamine and polyisocyanate-modified epoxy resin
IND TECH RES INST14 citations70
US5130407AJul 14, 1992
Hydantoin or barbituric acid-extended epoxy resin
IND TECH RES INST2 citations61
US5342736AAug 30, 1994
Method of wet etching of polyimide
IND TECH RES INST2 citations57
US5217599AJun 8, 1993
Bonding of polyimide film
IND TECH RES INST4 citations54
US5006615AApr 9, 1991
Hydantoin or barbituric acid-extended epoxy resin composition
IND TECH RES INST0 citations51
US5414059AMay 9, 1995
Low bromine-content materials for manufacturing printed circuit boards
IND TECH RES INST0 citations45