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Inventor

KWON JINSU

US6 patents
⚠️ This page may combine multiple inventors who share the name “KWON JINSU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

KWON JINSU

3 patents
US8558379B2Oct 15, 2013

Flip chip interconnection with double post

KWON JINSU54 citations94
US8505199B2Aug 13, 2013

Method of fabricating an interconnection element having conductive posts

KWON JINSU8 citations82
US8884448B2Nov 11, 2014

Flip chip interconnection with double post

KWON JINSU4 citations69

ADVANCED MICRO DEVICES INC

2 patents
US7253504B1Aug 7, 2007

Integrated circuit package and method

ADVANCED MICRO DEVICES INC23 citations92
US6842662B1Jan 11, 2005

Method and apparatus for fully aligned flip-chip assembly having a variable pitch packaging substrate

ADVANCED MICRO DEVICES INC3 citations59

TESSERA INC

1 patent
US9282640B2Mar 8, 2016

Interconnection element with posts formed by plating

TESSERA INC5 citations70