Inventor
BAIRD JOHN
US21 patents
⚠️ This page may combine multiple inventors who share the name “BAIRD JOHN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MOTOROLA INC
17 patentsUS5639695AJun 17, 1997
Low-profile ball-grid array semiconductor package and method
MOTOROLA INC126 citations97
US5541450AJul 30, 1996
Low-profile ball-grid array semiconductor package
MOTOROLA INC230 citations97
US5397917AMar 14, 1995
Semiconductor package capable of spreading heat
MOTOROLA INC230 citations96
US5118271AJun 2, 1992
Apparatus for encapsulating a semiconductor device
MOTOROLA INC57 citations96
US5252783AOct 12, 1993
Semiconductor package
MOTOROLA INC37 citations92
US5059105AOct 22, 1991
Resilient mold assembly
MOTOROLA INC35 citations92
US4615857AOct 7, 1986
Encapsulation means and method for reducing flash
MOTOROLA INC53 citations92
US4910581AMar 20, 1990
Internally molded isolated package
MOTOROLA INC20 citations82
US5123826AJun 23, 1992
Molding pot having configured bottom
MOTOROLA INC12 citations74
US5040965AAug 20, 1991
Molding handling aid
MOTOROLA INC15 citations74
US4996170AFeb 26, 1991
Molding process for encapsulating semiconductor devices using a thixotropic compound
MOTOROLA INC19 citations74
US4753160AJun 28, 1988
Mold press force equalizer
MOTOROLA INC18 citations74
US4741507AMay 3, 1988
Self-cleaning mold
MOTOROLA INC13 citations74
US5378928AJan 3, 1995
Plastic encapsulated microelectronic device and method
MOTOROLA INC6 citations72
US5139728AAug 18, 1992
Method of using molding pot having configured bottom
MOTOROLA INC3 citations63
US5535510AJul 16, 1996
Plastic encapsulated microelectronic device and method
MOTOROLA INC2 citations61
US5523629AJun 4, 1996
Plastic encapsulated microelectronic device
MOTOROLA INC3 citations61