Inventor
PARK SOO-JAE
KR9 patents
⚠️ This page may combine multiple inventors who share the name “PARK SOO-JAE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
8 patentsUS9978693B2May 22, 2018
Integrated circuit package, method of fabricating the same, and wearable device including integrated circuit package
SAMSUNG ELECTRONICS CO LTD9 citations81
US10204869B2Feb 12, 2019
Integrated circuit package including shielding between adjacent chips
SAMSUNG ELECTRONICS CO LTD3 citations70
US10586748B2Mar 10, 2020
Printed circuit board and semiconductor package
SAMSUNG ELECTRONICS CO LTD3 citations69
US10950517B2Mar 16, 2021
Printed circuit board and semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations59
US10448508B2Oct 15, 2019
Printed circuit board and semiconductor package including the same
SAMSUNG ELECTRONICS CO LTD1 citations59
US9396979B2Jul 19, 2016
Wafer carrier including air filters
SAMSUNG ELECTRONICS CO LTD0 citations44
US9368465B2Jun 14, 2016
Method of forming bump pad structure having buffer pattern
SAMSUNG ELECTRONICS CO LTD0 citations42
US10770384B2Sep 8, 2020
Printed circuit board having insulating metal oxide layer covering connection pad
SAMSUNG ELECTRONICS CO LTD0 citations39