P

Inventor

FIGURA THOMAS A

US75 patents
⚠️ This page may combine multiple inventors who share the name “FIGURA THOMAS A”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MICRON TECHNOLOGY INC

46 patents
US7416943B2Aug 26, 2008

Peripheral gate stacks and recessed array gates

MICRON TECHNOLOGY INC129 citations99
US6309975B1Oct 30, 2001

Methods of making implanted structures

MICRON TECHNOLOGY INC83 citations99
US6261964B1Jul 17, 2001

Material removal method for forming a structure

MICRON TECHNOLOGY INC309 citations99
US5597756AJan 28, 1997

Process for fabricating a cup-shaped DRAM capacitor using a multi-layer partly-sacrificial stack

MICRON TECHNOLOGY INC214 citations99
US5488011AJan 30, 1996

Method of forming contact areas between vertical conductors

MICRON TECHNOLOGY INC158 citations99
US6599840B2Jul 29, 2003

Material removal method for forming a structure

MICRON TECHNOLOGY INC54 citations96
US6461967B2Oct 8, 2002

Material removal method for forming a structure

MICRON TECHNOLOGY INC44 citations96
US6326295B1Dec 4, 2001

Method and structure for improved alignment tolerance in multiple, singulated plugs and interconnection

MICRON TECHNOLOGY INC33 citations96
US6048763AApr 11, 2000

Integrated capacitor bottom electrode with etch stop layer

MICRON TECHNOLOGY INC63 citations96
US6025624AFeb 15, 2000

Shared length cell for improved capacitance

MICRON TECHNOLOGY INC59 citations96
US5985732ANov 16, 1999

Method of forming integrated stacked capacitors with rounded corners

MICRON TECHNOLOGY INC46 citations96
US5849624ADec 15, 1998

Method of fabricating a bottom electrode with rounded corners for an integrated memory cell capacitor

MICRON TECHNOLOGY INC48 citations96
US5750441AMay 12, 1998

Mask having a tapered profile used during the formation of a semiconductor device

MICRON TECHNOLOGY INC37 citations96
US5654224AAug 5, 1997

Capacitor construction with oxidation barrier blocks

MICRON TECHNOLOGY INC43 citations96
US5472904ADec 5, 1995

Thermal trench isolation

MICRON TECHNOLOGY INC77 citations96
US5464786ANov 7, 1995

Method for forming a capacitor having recessed lateral reaction barrier layer edges

MICRON TECHNOLOGY INC60 citations96
US7939409B2May 10, 2011

Peripheral gate stacks and recessed array gates

MICRON TECHNOLOGY INC28 citations93
US6607966B2Aug 19, 2003

Selective method to form roughened silicon

MICRON TECHNOLOGY INC17 citations93
US6373084B2Apr 16, 2002

Shared length cell for improved capacitance

MICRON TECHNOLOGY INC16 citations93
US6303953B1Oct 16, 2001

Integrated capacitor bottom electrode with etch stop layer

MICRON TECHNOLOGY INC34 citations93
US6180452B1Jan 30, 2001

Shared length cell for improved capacitance

MICRON TECHNOLOGY INC22 citations93
US6066552AMay 23, 2000

Method and structure for improved alignment tolerance in multiple, singularized plugs

MICRON TECHNOLOGY INC16 citations93
US6027970AFeb 22, 2000

Method of increasing capacitance of memory cells incorporating hemispherical grained silicon

MICRON TECHNOLOGY INC39 citations93
US5872033AFeb 16, 1999

Method for increasing capacitance of an HSG rugged capacitor using a phosphine rich oxidation and subsequent wet etch

MICRON TECHNOLOGY INC31 citations93
US5837378ANov 17, 1998

Method of reducing stress-induced defects in silicon

MICRON TECHNOLOGY INC25 citations93
US5830793ANov 3, 1998

Method of selective texfturing for patterned polysilicon electrodes

MICRON TECHNOLOGY INC24 citations93
US5808854ASep 15, 1998

Capacitor construction with oxidation barrier blocks

MICRON TECHNOLOGY INC23 citations93
US5559666ASep 24, 1996

Capacitor construction with oxidation barrier blocks

MICRON TECHNOLOGY INC20 citations93
US7105403B2Sep 12, 2006

Double sided container capacitor for a semiconductor device and method for forming same

MICRON TECHNOLOGY INC19 citations92
US6645846B2Nov 11, 2003

Methods of forming conductive contacts to conductive structures

MICRON TECHNOLOGY INC15 citations92
US6596648B2Jul 22, 2003

Material removal method for forming a structure

MICRON TECHNOLOGY INC27 citations92
US6596642B2Jul 22, 2003

Material removal method for forming a structure

MICRON TECHNOLOGY INC18 citations92
US6534335B1Mar 18, 2003

Optimized low leakage diodes, including photodiodes

MICRON TECHNOLOGY INC27 citations92
US6117764ASep 12, 2000

Use of a plasma source to form a layer during the formation of a semiconductor device

MICRON TECHNOLOGY INC17 citations92
US5963804AOct 5, 1999

Method of making a doped silicon structure with impression image on opposing roughened surfaces

MICRON TECHNOLOGY INC25 citations92
US5950092ASep 7, 1999

Use of a plasma source to form a layer during the formation of a semiconductor device

MICRON TECHNOLOGY INC37 citations92
US7683413B2Mar 23, 2010

Double sided container capacitor for a semiconductor device

MICRON TECHNOLOGY INC13 citations84
US6507065B2Jan 14, 2003

Doped silicon structure with impression image on opposing roughened surfaces

MICRON TECHNOLOGY INC13 citations83
US5933727AAug 3, 1999

Method for increasing capacitance of an HSG rugged capacitor using a phosphine rich oxidation and subsequent wet etch

MICRON TECHNOLOGY INC14 citations82
US7019347B2Mar 28, 2006

Dynamic random access memory circuitry comprising insulative collars

MICRON TECHNOLOGY INC4 citations74
US6861713B2Mar 1, 2005

Integrated circuitry comprising insulative collars and integrated circuitry comprising sidewall spacers over a conductive line projecting outwardly from a first insulative material

MICRON TECHNOLOGY INC4 citations74
US6838714B2Jan 4, 2005

Low leakage diodes, including photodiodes

MICRON TECHNOLOGY INC8 citations74
US6524875B2Feb 25, 2003

Method for manufacturing tapered opening using an anisotropic etch during the formation of a semiconductor device

MICRON TECHNOLOGY INC8 citations74
US6429071B1Aug 6, 2002

Method of increasing capacitance of memory cells incorporating hemispherical grained silicon

MICRON TECHNOLOGY INC5 citations74
US6329109B1Dec 11, 2001

Mask having a tapered profile used during the formation of a semiconductor device

MICRON TECHNOLOGY INC12 citations74
US6323557B1Nov 27, 2001

Method and structure for improved alignment tolerance in multiple, singulated plugs

MICRON TECHNOLOGY INC3 citations74

MICRON SEMICONDUCTOR INC

3 patents

(unassigned)

1 patent

Showing the top 50 of 75 patents by PatentIndex Score.