Inventor
OHARA MUNEHARU
JP6 patents
Patents
6 patentsUS5482784AJan 9, 1996
Printed circuit inner-layer copper foil and process for producing the same
MITSUI MINING & SMELTING CO63 citations95
US5959256ASep 28, 1999
Multilayer printed wiring board
MITSUI MINING & SMELTING CO26 citations89
US5718039AFeb 17, 1998
Method of making multilayer printed wiring board
MITSUI MINING & SMELTING CO20 citations89
US5674611AOct 7, 1997
Adhesive for copper foils and an adhesive-applied copper foil
MITSUI MINING & SMELTING CO22 citations89
US5833819ANov 10, 1998
Copper foil for a printed circuit board, a process and an apparatus for producing the same
MITSUI MINING & SMELTING CO11 citations73
US5997710ADec 7, 1999
Copper foil for a printed circuit board, a process and an apparatus for producing the same
MITSUI MINING & SMELTING CO4 citations62