Inventor
WEISE MARK
US4 patents
Patents
4 patentsUS6106678AAug 22, 2000
Method of high density plasma CVD gap-filling
LAM RES CORP635 citations97
US5750211AMay 12, 1998
Process for depositing a SiOx film having reduced intrinsic stress and/or reduced hydrogen content
LAM RES CORP94 citations95
US6326064B1Dec 4, 2001
Process for depositing a SiOx film having reduced intrinsic stress and/or reduced hydrogen content
LAM RES CORP31 citations90
US7772128B2Aug 10, 2010
Semiconductor system with surface modification
LAM RES CORP1 citations49