Inventor

LIM LEE SUN

SG5 patents

⚠️ This page may combine multiple inventors who share the name “LIM LEE SUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHOW SENG GUAN

2 patents

US9252172B2Feb 2, 2016

Semiconductor device and method of forming EWLB semiconductor package with vertical interconnect structure and cavity region

CHOW SENG GUAN34 citations92

US9171769B2Oct 27, 2015

Semiconductor device and method of forming openings through encapsulant to reduce warpage and stress on semiconductor package

CHOW SENG GUAN2 citations61

DO BYUNG TAI

1 patent

US8110913B2Feb 7, 2012

Integrated circuit package system with integral inner lead and paddle

DO BYUNG TAI1 citations51

STATS CHIPPAC PTE LTD

1 patent

US12543590B2Feb 3, 2026

Semiconductor device and method of forming dummy vias in WLP

STATS CHIPPAC PTE LTD0 citations50

STATS CHIPPAC LTD

1 patent

US9620557B2Apr 11, 2017

Semiconductor device and method of forming EWLB semiconductor package with vertical interconnect structure and cavity region

STATS CHIPPAC LTD0 citations50