Inventor
HLAING MA PHOO PWINT
SG6 patents
⚠️ This page may combine multiple inventors who share the name “HLAING MA PHOO PWINT”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
CHOW SENG GUAN
2 patentsUS9252172B2Feb 2, 2016
Semiconductor device and method of forming EWLB semiconductor package with vertical interconnect structure and cavity region
CHOW SENG GUAN34 citations92
US9171769B2Oct 27, 2015
Semiconductor device and method of forming openings through encapsulant to reduce warpage and stress on semiconductor package
CHOW SENG GUAN2 citations61
BAO XUSHENG
2 patentsUS8963326B2Feb 24, 2015
Semiconductor device and method of forming patterned repassivation openings between RDL and UBM to reduce adverse effects of electro-migration
BAO XUSHENG13 citations80
US9142522B2Sep 22, 2015
Semiconductor device and method of forming RDL under bump for electrical connection to enclosed bump
BAO XUSHENG1 citations48
STATS CHIPPAC LTD
2 patentsUS9620557B2Apr 11, 2017
Semiconductor device and method of forming EWLB semiconductor package with vertical interconnect structure and cavity region
STATS CHIPPAC LTD0 citations50
US9397058B2Jul 19, 2016
Semiconductor device and method of forming patterned repassivation openings between RDL and UBM to reduce adverse effects of electro-migration
STATS CHIPPAC LTD1 citations50