Inventor
YIN HUNG-LIN
TW4 patents
Patents
4 patentsUS10156489B2Dec 18, 2018
Piezoresistive pressure sensor
ASIA PACIFIC MICROSYSTEMS INC5 citations65
US8916449B2Dec 23, 2014
Package structure and substrate bonding method
ASIA PACIFIC MICROSYSTEMS INC2 citations55
US12402243B2Aug 26, 2025
Circuit carrier board
ASIA PACIFIC MICROSYSTEMS INC0 citations39
US9553055B2Jan 24, 2017
Method for fabricating semiconductor devices having reinforcing elements
ASIA PACIFIC MICROSYSTEMS INC0 citations34