Inventor

ELDRIDGE BENJAMIN N

US226 patents

⚠️ This page may combine multiple inventors who share the name “ELDRIDGE BENJAMIN N”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

ELDRIDGE BENJAMIN N

FORMFACTOR INC

Methods of removably mounting electronic components to a circuit board, and sockets formed by the methods

Test head assembly for electronic components with plurality of contoured microelectronic spring contacts

Interconnect for microelectronic structures with enhanced spring characteristics

Test assembly including a test die for testing a semiconductor product die

Microelectronic contact structures, and methods of making same

Lithographic contact elements

Resilient contact structures for interconnecting electronic devices

Contact carriers (tiles) for populating larger substrates with spring contacts

Method of manufacturing a probe card

Electrical interconnect assemblies and methods

Spring interconnect structures

Predictive, adaptive power supply for an integrated circuit under test

Method and apparatus for burning-in semiconductor devices in wafer form

Method of fabricating shaped springs

Probe card assembly

Special contact points for accessing internal circuitry of an integrated circuit

Method of making lithographic contact springs

Special contact points for accessing internal circuitry of an integrated circuit

Test assembly including a test die for testing a semiconductor product die

Sockets for “springed” semiconductor devices

Microelectronic contact structures, and methods of making same

Planarizer for a semiconductor contactor

Methods for making spring interconnect structures

Probe card for probing wafers with raised contact elements

Microelectronic spring contact element and electronic component having a plurality of spring contact elements

Method of making microelectronic contact structures

Electrical contactor especially wafer level contactor using fluid pressure

Special contact points for accessing internal circuitry of an integrated circuit

Concurrent design and subsequent partitioning of product and test die

Apparatus for reducing power supply noise in an integrated circuit

Interconnect assemblies and methods including ancillary electronic component connected in immediate proximity of semiconductor device

Lithographic contact elements

Probe card assembly and kit, and methods of using same

Sockets for “springed” semiconductor devices

Method of making microelectronic spring contact elements

Method of modifying the thickness of a plating on a member by creating a temperature gradient on the member, applications for employing such a method, and structures resulting from such a method

Making discrete power connections to a space transformer of a probe card assembly

Electronic components with terminals and spring contact elements extending from areas which are remote from the terminals

Sockets for &#34;springed&#34; semiconductor devices

Wafer-level test and burn-in, and semiconductor process

Method of testing semiconductor

Fabricating interconnects and tips using sacrificial substrates

Method of temporarily, then permanently, connecting to a semiconductor device

Method of planarizing tips of probe elements of a probe card assembly

Mounting spring elements on semiconductor devices

Method of burning-in semiconductor devices

Method of making contact tip structures

(unassigned)

Method of fabricating an interconnection element

Sockets for "springed" semiconductor devices