Inventor

MATHIEU GAETAN L

US164 patents

⚠️ This page may combine multiple inventors who share the name “MATHIEU GAETAN L”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MATHIEU GAETAN L

FORMFACTOR INC

Method and system for compensating thermally induced motion of probe cards

Methods of removably mounting electronic components to a circuit board, and sockets formed by the methods

Method and apparatus for shaping spring elements

Interconnect for microelectronic structures with enhanced spring characteristics

Microelectronic contact structures, and methods of making same

Lithographic contact elements

Resilient contact structures for interconnecting electronic devices

Contact carriers (tiles) for populating larger substrates with spring contacts

Method of manufacturing a probe card

Method and apparatus for shaping spring elements

Spring interconnect structures

Method and apparatus for burning-in semiconductor devices in wafer form

Method of fabricating shaped springs

Probe card assembly

Method of making lithographic contact springs

Sockets for “springed” semiconductor devices

Microelectronic contact structures, and methods of making same

Planarizer for a semiconductor contactor

Methods for making spring interconnect structures

Microelectronic spring contact element and electronic component having a plurality of spring contact elements

Probe card for probing wafers with raised contact elements

Raised contact structures (solder columns)

Method of making microelectronic contact structures

Interconnection substrates with resilient contact structures on both sides

Lithographic contact elements

Probe card assembly and kit, and methods of using same

Sockets for “springed” semiconductor devices

Method of making microelectronic spring contact elements

Method of modifying the thickness of a plating on a member by creating a temperature gradient on the member, applications for employing such a method, and structures resulting from such a method

Making discrete power connections to a space transformer of a probe card assembly

Electronic components with terminals and spring contact elements extending from areas which are remote from the terminals

Apparatus for controlling plating over a face of a substrate

Sockets for &#34;springed&#34; semiconductor devices

Wafer-level test and burn-in, and semiconductor process

Composite interconnection element for microelectronic components, and method of making same

Method of testing semiconductor

Fabricating interconnects and tips using sacrificial substrates

Method of temporarily, then permanently, connecting to a semiconductor device

Method of planarizing tips of probe elements of a probe card assembly

Method of stacking electronic components

Flexible contact structure with an electrically conductive shell

Contact structure device for interconnections, interposer, semiconductor assembly and package using the same and method

Mounting spring elements on semiconductor devices

Method of burning-in semiconductor devices

Method of making contact tip structures

Method of making temporary connections between electronic components

Method of mounting resilient contact structures to semiconductor devices

(unassigned)

Method of fabricating an interconnection element

Sockets for "springed" semiconductor devices