Inventor
VELMURUGAN JEYAVEL
US6 patents
Patents
6 patentsUS10648097B2May 12, 2020
Copper electrodeposition on cobalt lined features
LAM RES CORP2 citations71
US12305307B2May 20, 2025
TSV process window and fill performance enhancement by long pulsing and ramping
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US11699590B2Jul 11, 2023
Copper electrodeposition sequence for the filling of cobalt lined features
LAM RES CORP0 citations61
US11168407B2Nov 9, 2021
Copper electrodeposition on cobalt lined features
LAM RES CORP0 citations61
US10930511B2Feb 23, 2021
Copper electrodeposition sequence for the filling of cobalt lined features
LAM RES CORP1 citations60
US12392047B2Aug 19, 2025
Byproduct removal from electroplating solutions
LAM RES CORP0 citations47