Inventor
HURWITT STEVEN
US26 patents
⚠️ This page may combine multiple inventors who share the name “HURWITT STEVEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MATERIALS RESEARCH CORP
10 patentsUS5223108AJun 29, 1993
Extended lifetime collimator
MATERIALS RESEARCH CORP78 citations96
US5154730AOct 13, 1992
Semiconductor wafer processing module having an inclined rotating wafer handling turret and a method of using the module
MATERIALS RESEARCH CORP65 citations94
US5409590AApr 25, 1995
Target cooling and support for magnetron sputter coating apparatus
MATERIALS RESEARCH CORP36 citations92
US5391281AFeb 21, 1995
Plasma shaping plug for control of sputter etching
MATERIALS RESEARCH CORP22 citations92
US5336386AAug 9, 1994
Target for cathode sputtering
MATERIALS RESEARCH CORP31 citations92
US5205051AApr 27, 1993
Method of preventing condensation of air borne moisture onto objects in a vessel during pumping thereof
MATERIALS RESEARCH CORP25 citations92
US5130005AJul 14, 1992
Magnetron sputter coating method and apparatus with rotating magnet cathode
MATERIALS RESEARCH CORP53 citations92
US3953703AApr 27, 1976
Method for drying ceramic tape
MATERIALS RESEARCH CORP51 citations92
US5449445ASep 12, 1995
Sputtering target with machine readable indicia
MATERIALS RESEARCH CORP15 citations78
US5284561AFeb 8, 1994
Method and apparatus for sputter coating employing machine readable indicia carried by target assembly
MATERIALS RESEARCH CORP19 citations78
TOKYO ELECTRON LTD
7 patentsUS5925226AJul 20, 1999
Apparatus and method for clamping a substrate
TOKYO ELECTRON LTD66 citations95
US6689254B1Feb 10, 2004
Sputtering apparatus with isolated coolant and sputtering target therefor
TOKYO ELECTRON LTD38 citations92
US6416635B1Jul 9, 2002
Method and apparatus for sputter coating with variable target to substrate spacing
TOKYO ELECTRON LTD29 citations92
US6623606B2Sep 23, 2003
Method and apparatus for sputter coating with variable target to substrate spacing
TOKYO ELECTRON LTD13 citations84
US6464841B1Oct 15, 2002
Cathode having variable magnet configuration
TOKYO ELECTRON LTD16 citations84
US5783048AJul 21, 1998
Sputtering cathode with uniformity compensation
TOKYO ELECTRON LTD13 citations74
US6183523B1Feb 6, 2001
Apparatus for thermal control of variously sized articles in vacuum
TOKYO ELECTRON LTD5 citations62
SONY CORP
6 patentsUS5795448AAug 18, 1998
Magnetic device for rotating a substrate
SONY CORP95 citations96
US5879524AMar 9, 1999
Composite backing plate for a sputtering target
SONY CORP48 citations92
US5620578AApr 15, 1997
Sputtering apparatus having an on board service module
SONY CORP29 citations92
US5804041ASep 8, 1998
Method and apparatus for forming a magnetically oriented thin film
SONY CORP9 citations74
US5569361AOct 29, 1996
Method and apparatus for cooling a sputtering target
SONY CORP15 citations74
US5490914AFeb 13, 1996
High utilization sputtering target for cathode assembly
SONY CORP14 citations67