Inventor
NATARAJAN GOVINDARAJAN
US98 patents
⚠️ This page may combine multiple inventors who share the name “NATARAJAN GOVINDARAJAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
44 patentsUS7992627B2Aug 9, 2011
Microjet module assembly
IBM55 citations98
US7516776B2Apr 14, 2009
Microjet module assembly
IBM68 citations98
US6459039B1Oct 1, 2002
Method and apparatus to manufacture an electronic package with direct wiring pattern
IBM125 citations98
US5541005AJul 30, 1996
Large ceramic article and method of manufacturing
IBM64 citations94
US7802442B2Sep 28, 2010
High power microjet cooler
IBM18 citations93
US6607620B2Aug 19, 2003
Greensheet carriers and processing thereof
IBM18 citations93
US6509687B1Jan 21, 2003
Metal/dielectric laminate with electrodes and process thereof
IBM21 citations93
US6258192B1Jul 10, 2001
Multi-thickness, multi-layer green sheet processing
IBM53 citations93
US5976286ANov 2, 1999
Multi-density ceramic structure and process thereof
IBM25 citations93
US5538582AJul 23, 1996
Method for forming cavities without using an insert
IBM25 citations93
US7255153B2Aug 14, 2007
High performance integrated MLC cooling device for high power density ICS and method for manufacturing
IBM25 citations92
US6726984B2Apr 27, 2004
Ceramic structure using a support sheet
IBM21 citations92
US6607780B1Aug 19, 2003
Process of forming a ceramic structure using a support sheet
IBM21 citations92
US6332782B1Dec 25, 2001
Spatial transformation interposer for electronic packaging
IBM53 citations92
US5468445ANov 21, 1995
Ceramic via composition, multilayer ceramic circuit containing same, and process for using same
IBM20 citations92
US6406778B1Jun 18, 2002
Multi-thickness, multi-layer green sheet lamination and method thereof
IBM18 citations91
US6245171B1Jun 12, 2001
Multi-thickness, multi-layer green sheet lamination and method thereof
IBM22 citations91
US5783026AJul 21, 1998
Apparatus for stacking sheets by carriers
IBM42 citations91
US5073180ADec 17, 1991
Method for forming sealed co-fired glass ceramic structures
IBM42 citations91
US7344679B2Mar 18, 2008
Method and apparatus for point of care osmolarity testing
IBM23 citations89
US6124041ASep 26, 2000
Copper-based paste containing copper aluminate for microstructural and shrinkage control of copper-filled vias
IBM35 citations89
US8585280B2Nov 19, 2013
Manufacturing a microfluid mixer
IBM8 citations84
US7536870B2May 26, 2009
High power microjet cooler
IBM10 citations84
US7332805B2Feb 19, 2008
Electronic package with improved current carrying capability and method of forming the same
IBM12 citations84
US6627020B2Sep 30, 2003
Method for sinter distortion control
IBM15 citations84
US6261927B1Jul 17, 2001
Method of forming defect-free ceramic structures using thermally depolymerizable surface layer
IBM16 citations84
US5788808AAug 4, 1998
Apparatus for forming cavity substrates using compressive pads
IBM18 citations84
US5746874AMay 5, 1998
Apparatus and method for forming cavity substrates using flexible preform insert
IBM17 citations82
US5925443AJul 20, 1999
Copper-based paste containing copper aluminate for microstructural and shrinkage control of copper-filled vias
IBM14 citations79
US6790515B2Sep 14, 2004
Greensheet carriers and processing thereof
IBM7 citations74
US6319554B1Nov 20, 2001
Method and apparatus for surface metallization
IBM8 citations74
US6245185B1Jun 12, 2001
Method of making a multilayer ceramic product with thin layers
IBM7 citations74
US5882455AMar 16, 1999
Apparatus and method for forming isotropic multilayer ceramic substrates
IBM12 citations74
US5665195ASep 9, 1997
Apparatus for forming cavities without using an insert
IBM8 citations74
US5639562AJun 17, 1997
Co-sintered surface metallization for pin-join, wire-bond and chip attach
IBM4 citations74
US5139975AAug 18, 1992
Sintering arrangement for enhancing removal of carbon from ceramic substrate laminates
IBM12 citations74
US5053361AOct 1, 1991
Setter tile for use in sintering of ceramic substrate laminates
IBM10 citations74
US10177075B2Jan 8, 2019
Liquid cooled compliant heat sink and related method
IBM2 citations73
US6597058B1Jul 22, 2003
Method of forming defect-free ceramic structures using thermally depolymerizable surface layer
IBM12 citations73
US5785800AJul 28, 1998
Apparatus for forming cavity structures using thermally decomposable surface layer
IBM15 citations73
US5759320AJun 2, 1998
Method of forming cavity substrates using compressive pads
IBM12 citations73
US5676788AOct 14, 1997
Method for forming cavity structures using thermally decomposable surface layer
IBM14 citations73
US5336444AAug 9, 1994
Ceramic via composition, multilayer ceramic circuit containing same, and process for using same
IBM14 citations73
US4971738ANov 20, 1990
Enhanced removal of carbon from ceramic substrate laminates
IBM16 citations73
CORNING INC
4 patentsUS9724727B2Aug 8, 2017
Methods for printing on glass
CORNING INC49 citations97
US10131118B2Nov 20, 2018
Strengthened laminated glass structures
CORNING INC61 citations96
US9963374B2May 8, 2018
Methods of forming laminated glass structures
CORNING INC50 citations92
US10195643B2Feb 5, 2019
Methods for printing ink on pre-treated glass substrates
CORNING INC2 citations72
NATARAJAN GOVINDARAJAN
2 patentsShowing the top 50 of 98 patents by PatentIndex Score.