P

Inventor

NATARAJAN GOVINDARAJAN

US98 patents
⚠️ This page may combine multiple inventors who share the name “NATARAJAN GOVINDARAJAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

IBM

44 patents
US7992627B2Aug 9, 2011

Microjet module assembly

IBM55 citations98
US7516776B2Apr 14, 2009

Microjet module assembly

IBM68 citations98
US6459039B1Oct 1, 2002

Method and apparatus to manufacture an electronic package with direct wiring pattern

IBM125 citations98
US5541005AJul 30, 1996

Large ceramic article and method of manufacturing

IBM64 citations94
US7802442B2Sep 28, 2010

High power microjet cooler

IBM18 citations93
US6607620B2Aug 19, 2003

Greensheet carriers and processing thereof

IBM18 citations93
US6509687B1Jan 21, 2003

Metal/dielectric laminate with electrodes and process thereof

IBM21 citations93
US6258192B1Jul 10, 2001

Multi-thickness, multi-layer green sheet processing

IBM53 citations93
US5976286ANov 2, 1999

Multi-density ceramic structure and process thereof

IBM25 citations93
US5538582AJul 23, 1996

Method for forming cavities without using an insert

IBM25 citations93
US7255153B2Aug 14, 2007

High performance integrated MLC cooling device for high power density ICS and method for manufacturing

IBM25 citations92
US6726984B2Apr 27, 2004

Ceramic structure using a support sheet

IBM21 citations92
US6607780B1Aug 19, 2003

Process of forming a ceramic structure using a support sheet

IBM21 citations92
US6332782B1Dec 25, 2001

Spatial transformation interposer for electronic packaging

IBM53 citations92
US5468445ANov 21, 1995

Ceramic via composition, multilayer ceramic circuit containing same, and process for using same

IBM20 citations92
US6406778B1Jun 18, 2002

Multi-thickness, multi-layer green sheet lamination and method thereof

IBM18 citations91
US6245171B1Jun 12, 2001

Multi-thickness, multi-layer green sheet lamination and method thereof

IBM22 citations91
US5783026AJul 21, 1998

Apparatus for stacking sheets by carriers

IBM42 citations91
US5073180ADec 17, 1991

Method for forming sealed co-fired glass ceramic structures

IBM42 citations91
US7344679B2Mar 18, 2008

Method and apparatus for point of care osmolarity testing

IBM23 citations89
US6124041ASep 26, 2000

Copper-based paste containing copper aluminate for microstructural and shrinkage control of copper-filled vias

IBM35 citations89
US8585280B2Nov 19, 2013

Manufacturing a microfluid mixer

IBM8 citations84
US7536870B2May 26, 2009

High power microjet cooler

IBM10 citations84
US7332805B2Feb 19, 2008

Electronic package with improved current carrying capability and method of forming the same

IBM12 citations84
US6627020B2Sep 30, 2003

Method for sinter distortion control

IBM15 citations84
US6261927B1Jul 17, 2001

Method of forming defect-free ceramic structures using thermally depolymerizable surface layer

IBM16 citations84
US5788808AAug 4, 1998

Apparatus for forming cavity substrates using compressive pads

IBM18 citations84
US5746874AMay 5, 1998

Apparatus and method for forming cavity substrates using flexible preform insert

IBM17 citations82
US5925443AJul 20, 1999

Copper-based paste containing copper aluminate for microstructural and shrinkage control of copper-filled vias

IBM14 citations79
US6790515B2Sep 14, 2004

Greensheet carriers and processing thereof

IBM7 citations74
US6319554B1Nov 20, 2001

Method and apparatus for surface metallization

IBM8 citations74
US6245185B1Jun 12, 2001

Method of making a multilayer ceramic product with thin layers

IBM7 citations74
US5882455AMar 16, 1999

Apparatus and method for forming isotropic multilayer ceramic substrates

IBM12 citations74
US5665195ASep 9, 1997

Apparatus for forming cavities without using an insert

IBM8 citations74
US5639562AJun 17, 1997

Co-sintered surface metallization for pin-join, wire-bond and chip attach

IBM4 citations74
US5139975AAug 18, 1992

Sintering arrangement for enhancing removal of carbon from ceramic substrate laminates

IBM12 citations74
US5053361AOct 1, 1991

Setter tile for use in sintering of ceramic substrate laminates

IBM10 citations74
US10177075B2Jan 8, 2019

Liquid cooled compliant heat sink and related method

IBM2 citations73
US6597058B1Jul 22, 2003

Method of forming defect-free ceramic structures using thermally depolymerizable surface layer

IBM12 citations73
US5785800AJul 28, 1998

Apparatus for forming cavity structures using thermally decomposable surface layer

IBM15 citations73
US5759320AJun 2, 1998

Method of forming cavity substrates using compressive pads

IBM12 citations73
US5676788AOct 14, 1997

Method for forming cavity structures using thermally decomposable surface layer

IBM14 citations73
US5336444AAug 9, 1994

Ceramic via composition, multilayer ceramic circuit containing same, and process for using same

IBM14 citations73
US4971738ANov 20, 1990

Enhanced removal of carbon from ceramic substrate laminates

IBM16 citations73

CORNING INC

4 patents

NATARAJAN GOVINDARAJAN

2 patents

Showing the top 50 of 98 patents by PatentIndex Score.