Inventor
LAU JOHN H
CA14 patents
⚠️ This page may combine multiple inventors who share the name “LAU JOHN H”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
EXPRESS PACKAGING SYSTEMS INC
3 patentsUS6075710AJun 13, 2000
Low-cost surface-mount compatible land-grid array (LGA) chip scale package (CSP) for packaging solder-bumped flip chips
EXPRESS PACKAGING SYSTEMS INC252 citations97
US6057601AMay 2, 2000
Heat spreader with a placement recess and bottom saw-teeth for connection to ground planes on a thin two-sided single-core BGA substrate
EXPRESS PACKAGING SYSTEMS INC242 citations96
US5825084AOct 20, 1998
Single-core two-side substrate with u-strip and co-planar signal traces, and power and ground planes through split-wrap-around (SWA) or split-via-connections (SVC) for packaging IC devices
EXPRESS PACKAGING SYSTEMS INC117 citations93