Inventor
LOVE DAVID G
US14 patents
⚠️ This page may combine multiple inventors who share the name “LOVE DAVID G”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
FUJITSU LTD
11 patentsUS5514906AMay 7, 1996
Apparatus for cooling semiconductor chips in multichip modules
FUJITSU LTD158 citations98
US5477160ADec 19, 1995
Module test card
FUJITSU LTD211 citations98
US5897341AApr 27, 1999
Diffusion bonded interconnect
FUJITSU LTD59 citations96
US5515604AMay 14, 1996
Methods for making high-density/long-via laminated connectors
FUJITSU LTD91 citations96
US5404265AApr 4, 1995
Interconnect capacitors
FUJITSU LTD85 citations96
US5363038ANov 8, 1994
Method and apparatus for testing an unpopulated chip carrier using a module test card
FUJITSU LTD74 citations96
US5536362AJul 16, 1996
Wire interconnect structures for connecting an integrated circuit to a substrate
FUJITSU LTD85 citations95
US6126059AOct 3, 2000
Captured-cell solder printing and reflow methods and apparatuses
FUJITSU LTD39 citations89
US5988487ANov 23, 1999
Captured-cell solder printing and reflow methods
FUJITSU LTD40 citations89
US5597412AJan 28, 1997
Apparatus for forcing plating solution into via openings
FUJITSU LTD10 citations73
US6168971B1Jan 2, 2001
Method of assembling thin film jumper connectors to a substrate
FUJITSU LTD7 citations72