Inventor
KIM BYUNGJO
KR4 patents
Patents
4 patentsUS11848301B2Dec 19, 2023
Method of manufacturing a semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations58
US11626381B2Apr 11, 2023
Bonding head including a thermal compensator, die bonding apparatus including the same and method of manufacturing semiconductor package using the same
SAMSUNG ELECTRONICS CO LTD0 citations58
US11869751B2Jan 9, 2024
Upper electrode and substrate processing apparatus including the same
SAMSUNG ELECTRONICS CO LTD0 citations57
US11545344B2Jan 3, 2023
Upper electrode and substrate processing apparatus including the same
SAMSUNG ELECTRONICS CO LTD0 citations57