Inventor
KAWADE MASATO
JP9 patents
⚠️ This page may combine multiple inventors who share the name “KAWADE MASATO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBIDEN CO LTD
8 patentsUS5827604AOct 27, 1998
Multilayer printed circuit board and method of producing the same
IBIDEN CO LTD84 citations95
US6261671B1Jul 17, 2001
Adhesive for electroless plating, feedstock composition for preparing adhesive for electroless plating, and printed wiring board
IBIDEN CO LTD52 citations94
US6251502B1Jun 26, 2001
Multilayer printed circuit board, method of producing multilayer printed circuit board and resin filler
IBIDEN CO LTD58 citations94
US6248428B1Jun 19, 2001
Adhesive for electroless plating, raw material composition for preparing adhesive for electroless plating and printed wiring board
IBIDEN CO LTD74 citations94
US6217988B1Apr 17, 2001
Multilayer printed circuit board, method of producing multilayer printed circuit board and resin filler
IBIDEN CO LTD38 citations94
US6010768AJan 4, 2000
Multilayer printed circuit board, method of producing multilayer printed circuit board and resin filler
IBIDEN CO LTD74 citations94
US6303880B1Oct 16, 2001
Printed circuit boards
IBIDEN CO LTD26 citations90
US6291778B1Sep 18, 2001
Printed circuit boards
IBIDEN CO LTD26 citations90