Inventor

ENDOU YOSHINORI

JP2 patents

Patents

2 patents

US7397139B2Jul 8, 2008

Epoxy resin molding material for sealing use and semiconductor device

HITACHI CHEMICAL CO LTD33 citations87

US7846998B2Dec 7, 2010

Sealant epoxy-resin molding material, and electronic component device

HITACHI CHEMICAL CO LTD23 citations86