Inventor

MOTSCHMAN DAVID R

US9 patents

⚠️ This page may combine multiple inventors who share the name “MOTSCHMAN DAVID R”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

IBM

5 patents

US5027254AJun 25, 1991

Apparatus for cooling electronics components

IBM69 citations92

US9245813B2Jan 26, 2016

Horizontally aligned graphite nanofibers in etched silicon wafer troughs for enhanced thermal performance

IBM13 citations81

US9655287B1May 16, 2017

BARTLEY GERALD K

2 patents

US8299608B2Oct 30, 2012

Enhanced thermal management of 3-D stacked die packaging

BARTLEY GERALD K60 citations97

US9111899B2Aug 18, 2015

Horizontally and vertically aligned graphite nanofibers thermal interface material for use in chip stacks

BARTLEY GERALD K5 citations72

MOTSCHMAN DAVID R

1 patent

US8139355B2Mar 20, 2012

Memory module connector having memory module cooling structures

MOTSCHMAN DAVID R10 citations73

CHER CHEN-YONG

1 patent

US8489217B2Jul 16, 2013

Thermal cycling and gradient management in three-dimensional stacked architectures

CHER CHEN-YONG3 citations62

MOTSCHMAN DAVID R

IBM

Apparatus for cooling electronics components

Horizontally aligned graphite nanofibers in etched silicon wafer troughs for enhanced thermal performance

Heat exchangers for cooling integrated circuits

Air-cooled heatsink for cooling integrated circuits

Method and system for internal layer-layer thermal enhancement

BARTLEY GERALD K

Enhanced thermal management of 3-D stacked die packaging

Horizontally and vertically aligned graphite nanofibers thermal interface material for use in chip stacks

MOTSCHMAN DAVID R

Memory module connector having memory module cooling structures

CHER CHEN-YONG

Thermal cycling and gradient management in three-dimensional stacked architectures