Inventor

ZU LONGQIANG

US8 patents

⚠️ This page may combine multiple inventors who share the name “ZU LONGQIANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SARCINA TECH LLC

3 patents

US10410984B1Sep 10, 2019

Package substrate differential impedance optimization for 25 to 60 GBPS and beyond

SARCINA TECH LLC13 citations78

US9666544B2May 30, 2017

Package substrate differential impedance optimization for 25 GBPS and beyond

SARCINA TECH LLC15 citations78

US10276519B2Apr 30, 2019

Package substrate differential impedance optimization for 25 to 60 Gbps and beyond

SARCINA TECH LLC0 citations36

INTEL CORP

2 patents

US6177732B1Jan 23, 2001

Multi-layer organic land grid array to minimize via inductance

INTEL CORP24 citations90

US6303871B1Oct 16, 2001

Degassing hole design for olga trace impedance

INTEL CORP28 citations89

ZU LONGQIANG

2 patents

US8152048B2Apr 10, 2012

Method and structure for adapting solder column to warped substrate

ZU LONGQIANG10 citations79

US8247909B2Aug 21, 2012

Semiconductor package device with cavity structure and the packaging method thereof

ZU LONGQIANG2 citations59

CHEN CHIEN-WEN

1 patent

US8278145B2Oct 2, 2012

Method for packaging semiconductor device

CHEN CHIEN-WEN0 citations38