P

Inventor

DONOHOE KEVIN G

US105 patents
⚠️ This page may combine multiple inventors who share the name “DONOHOE KEVIN G”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MICRON TECHNOLOGY INC

49 patents
US6784108B1Aug 31, 2004

Gas pulsing for etch profile control

MICRON TECHNOLOGY INC567 citations99
US6414376B1Jul 2, 2002

Method and apparatus for reducing isolation stress in integrated circuits

MICRON TECHNOLOGY INC212 citations99
US6132552AOct 17, 2000

Method and apparatus for controlling the temperature of a gas distribution plate in a process reactor

MICRON TECHNOLOGY INC121 citations99
US5662770ASep 2, 1997

Method and apparatus for improving etch uniformity in remote source plasma reactors with powered wafer chucks

MICRON TECHNOLOGY INC119 citations99
US6582512B2Jun 24, 2003

Method of forming three-dimensional photonic band structures in solid materials

MICRON TECHNOLOGY INC87 citations98
US6356500B1Mar 12, 2002

Reduced power DRAM device and method

MICRON TECHNOLOGY INC180 citations98
US6309978B1Oct 30, 2001

Beat frequency modulation for plasma generation

MICRON TECHNOLOGY INC121 citations97
US5904799AMay 18, 1999

Method and apparatus for improving etch uniformity in remote source plasma reactors with powered wafer chucks

MICRON TECHNOLOGY INC84 citations97
US6946053B2Sep 20, 2005

Plasma reactor

MICRON TECHNOLOGY INC30 citations96
US6890858B2May 10, 2005

Methods of forming materials over uneven surface topologies, and methods of forming insulative materials over and between conductive lines

MICRON TECHNOLOGY INC34 citations96
US6630410B2Oct 7, 2003

Self-aligned PECVD etch mask

MICRON TECHNOLOGY INC48 citations96
US6544895B1Apr 8, 2003

Methods for use of pulsed voltage in a plasma reactor

MICRON TECHNOLOGY INC66 citations96
US6511912B1Jan 28, 2003

Method of forming a non-conformal layer over and exposing a trench

MICRON TECHNOLOGY INC56 citations96
US6451705B1Sep 17, 2002

Self-aligned PECVD etch mask

MICRON TECHNOLOGY INC66 citations96
US6413358B2Jul 2, 2002

Method and apparatus for improving etch uniformity in remote source plasma reactors with powered wafer chucks

MICRON TECHNOLOGY INC52 citations96
US6290806B1Sep 18, 2001

Plasma reactor

MICRON TECHNOLOGY INC76 citations96
US6184146B1Feb 6, 2001

Plasma producing tools, dual-source plasma etchers, dual-source plasma etching methods, and method of forming planar coil dual-source plasma etchers

MICRON TECHNOLOGY INC38 citations96
US6093655AJul 25, 2000

Plasma etching methods

MICRON TECHNOLOGY INC52 citations96
US6074953AJun 13, 2000

Dual-source plasma etchers, dual-source plasma etching methods, and methods of forming planar coil dual-source plasma etchers

MICRON TECHNOLOGY INC35 citations96
US5985375ANov 16, 1999

Method for pulsed-plasma enhanced vapor deposition

MICRON TECHNOLOGY INC76 citations96
US5882535AMar 16, 1999

Method for forming a hole in a semiconductor device

MICRON TECHNOLOGY INC68 citations96
US7059267B2Jun 13, 2006

Use of pulsed grounding source in a plasma reactor

MICRON TECHNOLOGY INC69 citations95
US6312556B1Nov 6, 2001

Beat frequency modulation for plasma generation

MICRON TECHNOLOGY INC55 citations94
US6126778AOct 3, 2000

Beat frequency modulation for plasma generation

MICRON TECHNOLOGY INC42 citations94
US7253117B2Aug 7, 2007

Methods for use of pulsed voltage in a plasma reactor

MICRON TECHNOLOGY INC34 citations93
US7163641B2Jan 16, 2007

Method of forming high aspect ratio apertures

MICRON TECHNOLOGY INC16 citations93
US6890863B1May 10, 2005

Etchant and method of use

MICRON TECHNOLOGY INC26 citations93
US6516742B1Feb 11, 2003

Apparatus for improved low pressure inductively coupled high density plasma reactor

MICRON TECHNOLOGY INC24 citations93
US6503410B1Jan 7, 2003

Method of modifying an RF circuit of a plasma chamber to increase chamber life and process capabilities

MICRON TECHNOLOGY INC17 citations93
US6500300B2Dec 31, 2002

Plasma reactor

MICRON TECHNOLOGY INC16 citations93
US6315859B1Nov 13, 2001

Apparatus and method for improving uniformity in batch processing of semiconductor wafers

MICRON TECHNOLOGY INC29 citations93
US6277759B1Aug 21, 2001

Plasma etching methods

MICRON TECHNOLOGY INC16 citations93
US6271141B2Aug 7, 2001

Methods of forming materials over uneven surface topologies, and methods of forming insulative materials over and between conductive lines

MICRON TECHNOLOGY INC18 citations93
US6204604B1Mar 20, 2001

Method and apparatus for controlling electrostatic coupling to plasmas

MICRON TECHNOLOGY INC20 citations93
US6123862ASep 26, 2000

Method of forming high aspect ratio apertures

MICRON TECHNOLOGY INC28 citations93
US6114252ASep 5, 2000

Plasma processing tools, dual-source plasma etchers, dual-source plasma etching methods, and methods of forming planar coil dual-source plasma etchers

MICRON TECHNOLOGY INC30 citations93
US6095159AAug 1, 2000

Method of modifying an RF circuit of a plasma chamber to increase chamber life and process capabilities

MICRON TECHNOLOGY INC21 citations93
US6051511AApr 18, 2000

Method and apparatus for reducing isolation stress in integrated circuits

MICRON TECHNOLOGY INC26 citations93
US6025276AFeb 15, 2000

Semiconductor processing methods of forming substrate features, including contact openings

MICRON TECHNOLOGY INC28 citations93
US5998931ADec 7, 1999

Method and apparatus for controlling electrostatic coupling to plasmas

MICRON TECHNOLOGY INC22 citations93
US5651856AJul 29, 1997

Selective etch process

MICRON TECHNOLOGY INC25 citations93
US6475920B2Nov 5, 2002

Plasma etching method using low ionization potential gas

MICRON TECHNOLOGY INC28 citations92
US6258728B1Jul 10, 2001

Plasma etching methods

MICRON TECHNOLOGY INC18 citations92
US6228775B1May 8, 2001

Plasma etching method using low ionization potential gas

MICRON TECHNOLOGY INC35 citations92
US6117764ASep 12, 2000

Use of a plasma source to form a layer during the formation of a semiconductor device

MICRON TECHNOLOGY INC17 citations92
US6074957AJun 13, 2000

Methods of forming openings and methods of controlling the degree of taper of openings

MICRON TECHNOLOGY INC21 citations92
US6010967AJan 4, 2000

Plasma etching methods

MICRON TECHNOLOGY INC23 citations92
US5950092ASep 7, 1999

Use of a plasma source to form a layer during the formation of a semiconductor device

MICRON TECHNOLOGY INC37 citations92
US6716758B1Apr 6, 2004

Aspect ratio controlled etch selectivity using time modulated DC bias voltage

MICRON TECHNOLOGY INC52 citations91

MICRON SEMICONDUCTOR INC

1 patent

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