Inventor
DONOHOE KEVIN G
US105 patents
⚠️ This page may combine multiple inventors who share the name “DONOHOE KEVIN G”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MICRON TECHNOLOGY INC
49 patentsUS6784108B1Aug 31, 2004
Gas pulsing for etch profile control
MICRON TECHNOLOGY INC567 citations99
US6414376B1Jul 2, 2002
Method and apparatus for reducing isolation stress in integrated circuits
MICRON TECHNOLOGY INC212 citations99
US6132552AOct 17, 2000
Method and apparatus for controlling the temperature of a gas distribution plate in a process reactor
MICRON TECHNOLOGY INC121 citations99
US5662770ASep 2, 1997
Method and apparatus for improving etch uniformity in remote source plasma reactors with powered wafer chucks
MICRON TECHNOLOGY INC119 citations99
US6582512B2Jun 24, 2003
Method of forming three-dimensional photonic band structures in solid materials
MICRON TECHNOLOGY INC87 citations98
US6356500B1Mar 12, 2002
Reduced power DRAM device and method
MICRON TECHNOLOGY INC180 citations98
US6309978B1Oct 30, 2001
Beat frequency modulation for plasma generation
MICRON TECHNOLOGY INC121 citations97
US5904799AMay 18, 1999
Method and apparatus for improving etch uniformity in remote source plasma reactors with powered wafer chucks
MICRON TECHNOLOGY INC84 citations97
US6946053B2Sep 20, 2005
Plasma reactor
MICRON TECHNOLOGY INC30 citations96
US6890858B2May 10, 2005
Methods of forming materials over uneven surface topologies, and methods of forming insulative materials over and between conductive lines
MICRON TECHNOLOGY INC34 citations96
US6630410B2Oct 7, 2003
Self-aligned PECVD etch mask
MICRON TECHNOLOGY INC48 citations96
US6544895B1Apr 8, 2003
Methods for use of pulsed voltage in a plasma reactor
MICRON TECHNOLOGY INC66 citations96
US6511912B1Jan 28, 2003
Method of forming a non-conformal layer over and exposing a trench
MICRON TECHNOLOGY INC56 citations96
US6451705B1Sep 17, 2002
Self-aligned PECVD etch mask
MICRON TECHNOLOGY INC66 citations96
US6413358B2Jul 2, 2002
Method and apparatus for improving etch uniformity in remote source plasma reactors with powered wafer chucks
MICRON TECHNOLOGY INC52 citations96
US6290806B1Sep 18, 2001
Plasma reactor
MICRON TECHNOLOGY INC76 citations96
US6184146B1Feb 6, 2001
Plasma producing tools, dual-source plasma etchers, dual-source plasma etching methods, and method of forming planar coil dual-source plasma etchers
MICRON TECHNOLOGY INC38 citations96
US6093655AJul 25, 2000
Plasma etching methods
MICRON TECHNOLOGY INC52 citations96
US6074953AJun 13, 2000
Dual-source plasma etchers, dual-source plasma etching methods, and methods of forming planar coil dual-source plasma etchers
MICRON TECHNOLOGY INC35 citations96
US5985375ANov 16, 1999
Method for pulsed-plasma enhanced vapor deposition
MICRON TECHNOLOGY INC76 citations96
US5882535AMar 16, 1999
Method for forming a hole in a semiconductor device
MICRON TECHNOLOGY INC68 citations96
US7059267B2Jun 13, 2006
Use of pulsed grounding source in a plasma reactor
MICRON TECHNOLOGY INC69 citations95
US6312556B1Nov 6, 2001
Beat frequency modulation for plasma generation
MICRON TECHNOLOGY INC55 citations94
US6126778AOct 3, 2000
Beat frequency modulation for plasma generation
MICRON TECHNOLOGY INC42 citations94
US7253117B2Aug 7, 2007
Methods for use of pulsed voltage in a plasma reactor
MICRON TECHNOLOGY INC34 citations93
US7163641B2Jan 16, 2007
Method of forming high aspect ratio apertures
MICRON TECHNOLOGY INC16 citations93
US6890863B1May 10, 2005
Etchant and method of use
MICRON TECHNOLOGY INC26 citations93
US6516742B1Feb 11, 2003
Apparatus for improved low pressure inductively coupled high density plasma reactor
MICRON TECHNOLOGY INC24 citations93
US6503410B1Jan 7, 2003
Method of modifying an RF circuit of a plasma chamber to increase chamber life and process capabilities
MICRON TECHNOLOGY INC17 citations93
US6500300B2Dec 31, 2002
Plasma reactor
MICRON TECHNOLOGY INC16 citations93
US6315859B1Nov 13, 2001
Apparatus and method for improving uniformity in batch processing of semiconductor wafers
MICRON TECHNOLOGY INC29 citations93
US6277759B1Aug 21, 2001
Plasma etching methods
MICRON TECHNOLOGY INC16 citations93
US6271141B2Aug 7, 2001
Methods of forming materials over uneven surface topologies, and methods of forming insulative materials over and between conductive lines
MICRON TECHNOLOGY INC18 citations93
US6204604B1Mar 20, 2001
Method and apparatus for controlling electrostatic coupling to plasmas
MICRON TECHNOLOGY INC20 citations93
US6123862ASep 26, 2000
Method of forming high aspect ratio apertures
MICRON TECHNOLOGY INC28 citations93
US6114252ASep 5, 2000
Plasma processing tools, dual-source plasma etchers, dual-source plasma etching methods, and methods of forming planar coil dual-source plasma etchers
MICRON TECHNOLOGY INC30 citations93
US6095159AAug 1, 2000
Method of modifying an RF circuit of a plasma chamber to increase chamber life and process capabilities
MICRON TECHNOLOGY INC21 citations93
US6051511AApr 18, 2000
Method and apparatus for reducing isolation stress in integrated circuits
MICRON TECHNOLOGY INC26 citations93
US6025276AFeb 15, 2000
Semiconductor processing methods of forming substrate features, including contact openings
MICRON TECHNOLOGY INC28 citations93
US5998931ADec 7, 1999
Method and apparatus for controlling electrostatic coupling to plasmas
MICRON TECHNOLOGY INC22 citations93
US5651856AJul 29, 1997
Selective etch process
MICRON TECHNOLOGY INC25 citations93
US6475920B2Nov 5, 2002
Plasma etching method using low ionization potential gas
MICRON TECHNOLOGY INC28 citations92
US6258728B1Jul 10, 2001
Plasma etching methods
MICRON TECHNOLOGY INC18 citations92
US6228775B1May 8, 2001
Plasma etching method using low ionization potential gas
MICRON TECHNOLOGY INC35 citations92
US6117764ASep 12, 2000
Use of a plasma source to form a layer during the formation of a semiconductor device
MICRON TECHNOLOGY INC17 citations92
US6074957AJun 13, 2000
Methods of forming openings and methods of controlling the degree of taper of openings
MICRON TECHNOLOGY INC21 citations92
US6010967AJan 4, 2000
Plasma etching methods
MICRON TECHNOLOGY INC23 citations92
US5950092ASep 7, 1999
Use of a plasma source to form a layer during the formation of a semiconductor device
MICRON TECHNOLOGY INC37 citations92
US6716758B1Apr 6, 2004
Aspect ratio controlled etch selectivity using time modulated DC bias voltage
MICRON TECHNOLOGY INC52 citations91
MICRON SEMICONDUCTOR INC
1 patentShowing the top 50 of 105 patents by PatentIndex Score.