Inventor
KYOMASU RYUICHI
JP23 patents
⚠️ This page may combine multiple inventors who share the name “KYOMASU RYUICHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SHINKAWA KK
18 patentsUS6467673B2Oct 22, 2002
Bonding apparatus and bonding method
SHINKAWA KK27 citations92
US6464126B2Oct 15, 2002
Bonding apparatus and bonding method
SHINKAWA KK32 citations92
US6449516B1Sep 10, 2002
Bonding method and apparatus
SHINKAWA KK49 citations92
US5486733AJan 23, 1996
Bonding apparatus
SHINKAWA KK44 citations92
US6491202B1Dec 10, 2002
Wire bonding apparatus and method
SHINKAWA KK23 citations91
US5385288AJan 31, 1995
Bonding apparatus
SHINKAWA KK26 citations91
US6762848B2Jul 13, 2004
Offset measurement method, tool position detection method and bonding apparatus
SHINKAWA KK13 citations83
US6863206B2Mar 8, 2005
Bonding apparatus
SHINKAWA KK8 citations74
US6189761B1Feb 20, 2001
Wire bonding apparatus
SHINKAWA KK14 citations74
US5411195AMay 2, 1995
Bonding apparatus
SHINKAWA KK10 citations74
US6467679B2Oct 22, 2002
Wire bonding method
SHINKAWA KK11 citations72
US6135338AOct 24, 2000
Capillary holding structure for ultrasonic horn
SHINKAWA KK12 citations72
US6719183B2Apr 13, 2004
Transducer and a bonding apparatus using the same
SHINKAWA KK7 citations71
US6871772B2Mar 29, 2005
Wire bonding apparatus
SHINKAWA KK3 citations63
US6814121B2Nov 9, 2004
Bonding apparatus
SHINKAWA KK4 citations62
US6422448B2Jul 23, 2002
Ultrasonic horn for a bonding apparatus
SHINKAWA KK6 citations62
US6766936B2Jul 27, 2004
Transducer and a bonding apparatus using the same
SHINKAWA KK5 citations61
US6727666B2Apr 27, 2004
XY table for a semiconductor manufacturing apparatus
SHINKAWA KK5 citations58
HITACHI LTD
4 patentsUS4763827AAug 16, 1988
Manufacturing method
HITACHI LTD28 citations92
US4674670AJun 23, 1987
Manufacturing apparatus
HITACHI LTD25 citations92
US4315199AFeb 9, 1982
Control circuit for a positioning device using a d-c motor
HITACHI LTD12 citations72
US4347964ASep 7, 1982
Wire bonding apparatus
HITACHI LTD18 citations71