Inventor
WINCHELL II VERN H
6 patents
Patents
6 patentsUS4722914AFeb 2, 1988
Method of making a high density IC module assembly
MOTOROLA INC63 citations94
US4630096ADec 16, 1986
High density IC module assembly
MOTOROLA INC118 citations94
US5164885ANov 17, 1992
Electronic package having a non-oxide ceramic bonded to metal and method for making
MOTOROLA INC11 citations72
US4394678AJul 19, 1983
Elevated edge-protected bonding pedestals for semiconductor devices
MOTOROLA INC15 citations71
US5886362AMar 23, 1999
Method of reflowing solder bumps after probe test
MOTOROLA INC12 citations65
US4609936ASep 2, 1986
Semiconductor chip with direct-bonded external leadframe
MOTOROLA INC5 citations60