Inventor
DO HUONG T
US8 patents
Patents
8 patentsUS6446317B1Sep 10, 2002
Hybrid capacitor and method of fabrication therefor
INTEL CORP208 citations98
US6532143B2Mar 11, 2003
Multiple tier array capacitor
INTEL CORP101 citations96
US6366467B1Apr 2, 2002
Dual-socket interposer and method of fabrication therefor
INTEL CORP97 citations96
US6920051B2Jul 19, 2005
Hybrid capacitor, circuit, and system
INTEL CORP37 citations92
US6483692B2Nov 19, 2002
Capacitor with extended surface lands and method of fabrication therefor
INTEL CORP33 citations91
US6469908B2Oct 22, 2002
Dual-socket interposer and method of fabrication therefor
INTEL CORP40 citations91
US11690165B2Jun 27, 2023
Package substrate inductor having thermal interconnect structures
INTEL CORP1 citations60
US11357096B2Jun 7, 2022
Package substrate inductor having thermal interconnect structures
INTEL CORP1 citations60