Inventor
COHEN STEPHAN ALAN
US11 patents
Patents
11 patentsUS6184121B1Feb 6, 2001
Chip interconnect wiring structure with low dielectric constant insulator and methods for fabricating the same
IBM369 citations98
US6577011B1Jun 10, 2003
Chip interconnect wiring structure with low dielectric constant insulator and methods for fabricating the same
IBM86 citations97
US5876788AMar 2, 1999
High dielectric TiO2 -SiN composite films for memory applications
IBM97 citations96
US5679269AOct 21, 1997
Diamond-like carbon for use in VLSI and ULSI interconnect systems
IBM66 citations95
US5674355AOct 7, 1997
Diamond-like carbon for use in VLSI and ULSI interconnect systems
IBM46 citations95
US6784485B1Aug 31, 2004
Diffusion barrier layer and semiconductor device containing same
IBM25 citations91
US6014310AJan 11, 2000
High dielectric TiO2 -SiN composite films for memory applications
IBM14 citations81
US6414377B1Jul 2, 2002
Low k dielectric materials with inherent copper ion migration barrier
IBM10 citations74
US6730618B2May 4, 2004
Low k dielectric materials with inherent copper ion migration barrier
IBM3 citations63
US6559046B1May 6, 2003
Insulator for integrated circuits and process
IBM3 citations61
US7172968B2Feb 6, 2007
Ultra thin, single phase, diffusion barrier for metal conductors
IBM0 citations48